參數(shù)資料
型號(hào)： SC16IS740IPW
廠商： NXP Semiconductors N.V.
元件分類： 連接器件
英文描述： Single UART with I2C-bus-SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
封裝： SC16IS740IPW/Q900<SOT403-1 (TSSOP16)|<<http://www.nxp.com/packages/SOT403-1.html<1<Always Pb-free,;SC16IS740IPW<SOT403-1 (TSSOP16)|<<http://www.nxp.com/packages/SOT403-1.
文件頁數(shù)： 58/62頁
文件大?。?/td> 308K
代理商： SC16IS740IPW
SC16IS740_750_760_6
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 13 May 2008
58 of 62
NXP Semiconductors
SC16IS740/750/760
Single UART with I
2
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 44
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 41
and
42
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 44
.
Table 41.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 42.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
相關(guān)PDF資料
PDF描述
SC16IS750IBS Single UART with I2C-bus-SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
SC16IS750IPW Single UART with I2C-bus-SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
SC16IS760IBS Single UART with I2C-bus-SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
SC16IS760IPW Single UART with I2C-bus-SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
SC16IS741IPW Single UART with I2C-bus-SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16IS740IPW,112 功能描述:UART 接口集成電路 UART SINGLE W/FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16IS740IPW,128 功能描述:UART 接口集成電路 I2C/SPI-SLAVEBRIDGE RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16IS740IPW/Q900, 功能描述:UART 接口集成電路 I2C/SPI-UART BRIDGE W/IRDA RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16IS740IPW/Q900,128 制造商:NXP Semiconductors 功能描述:0
SC16IS740IPW112 制造商:NXP Semiconductors 功能描述:IC SINGLE UART FIFO 5MBPS 3.6V TSSOP-16 制造商:NXP Semiconductors 功能描述:IC UART FIFO 5MBPS 3.6V 16TSSOP
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*