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參數(shù)資料
| 型號： | SC16C650BIN40,112 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 38/48頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC UART SINGLE W/FIFO 40-DIP |
| 標(biāo)準(zhǔn)包裝： | 9 |
| 通道數(shù)： | 1，UART |
| FIFO's： | 32 字節(jié) |
| 電源電壓： | 2.5V，3.3V，5V |
| 帶自動流量控制功能： | 是 |
| 帶IrDA 編碼器/解碼器： | 是 |
| 帶故障啟動位檢測功能： | 是 |
| 帶調(diào)制解調(diào)器控制功能： | 是 |
| 帶CMOS： | 是 |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 40-DIP（0.600"，15.24mm） |
| 供應(yīng)商設(shè)備封裝： | 40-DIP |
| 包裝： | 管件 |
| 其它名稱： | 568-2045-5 935274389112 SC16C650BIN40 |
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SC16C650B_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 14 September 2009
43 of 48
NXP Semiconductors
SC16C650B
UART with 32-byte FIFOs and IrDA encoder/decoder
12.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 25) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 29 and 30
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 25.
Table 29.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 30.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C652 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual UART with 32 bytes of transmit and receive FIFOs |
| SC16C652B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5V, 3.3 V and 2.5V dual UART, 5 Mbit/s (max.),with 32-byte FIFOs and infrared(IrDA) encoder/decoder |
| SC16C652BIB48 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH UART 32B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C652BIB48,128 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C652BIB48,151 | 功能描述:UART 接口集成電路 2CH. UART 32B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
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