參數(shù)資料
型號(hào)： SC16C550BIN40,112
廠商： NXP Semiconductors
文件頁數(shù)： 39/48頁
文件大?。?/td> 0K
描述： IC UART 40-DIP
標(biāo)準(zhǔn)包裝： 9
特點(diǎn)： 可編程
通道數(shù)： 1，UART
FIFO's： 16 字節(jié)
電源電壓： 2.5V，3.3V，5V
帶自動(dòng)流量控制功能： 是
帶故障啟動(dòng)位檢測功能： 是
帶調(diào)制解調(diào)器控制功能： 是
帶CMOS： 是
安裝類型： 通孔
封裝/外殼： 40-DIP（0.600"，15.24mm）
供應(yīng)商設(shè)備封裝： 40-DIP
包裝： 管件
其它名稱： 935274386112
SC16C550BIN40
SC16C550BIN40-ND
SC16C550B_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 1 October 2008
44 of 48
NXP Semiconductors
SC16C550B
5 V, 3.3 V and 2.5 V UART with 16-byte FIFOs
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
13. Soldering of through-hole mount packages
13.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
13.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specied maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
13.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°C and 400 °C, contact may be up to 5 seconds.
MSL: Moisture Sensitivity Level
Fig 28. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C550IA44 制造商:NXP Semiconductors 功能描述:UART 16BYTE FIFO 16C550 PLCC44
SC16C550IA44,512 功能描述:UART 接口集成電路 16C 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550IA44,518 功能描述:UART 接口集成電路 16C 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550IA44,529 功能描述:UART 接口集成電路 16C 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550IB48 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Asynchronous Receiver/Transmitter (UART) with 16-byte FIFO and infrared (IrDA) encoder/decoder
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