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Publication Number S29VS_XS064R_00
Revision 06
Issue Date July 22, 2011
Distinctive Characteristics
Single 1.8 volt read, program and erase
(1.7 to 1.95 volt)
VersatileIO Feature
– Device generates data output voltages and tolerates data input
voltages as determined by the voltage on the VCCQ pin
– 1.8 V compatible I/O signals
Address and Data Interface Options
– Address and Data Multiplexed for reduced I/O count
(ADM) S29VS-R
– Address-High, Address-Low, Data Multiplexed for minimum I/O
count (AADM) S29XS-R
Simultaneous Read/Write operation
– Data can be continuously read from one bank while executing
erase/program functions in other bank
– Zero latency between read and write operations
Burst length
– Continuous linear burst
– 8/16 word linear burst with wrap around
Secured Silicon Sector region
– 256 words accessible through a command sequence, 128 words for
the Factory Secured Silicon Sector and 128 words for the Customer
Secured Silicon Sector.
Sector Architecture
– Four 8 kword sectors in upper-most address range
– One hundred twenty-seven 32 kword sectors
– Four banks
Security Features
Dynamic Protection Bit (DYB)
– A command sector protection method to lock combinations of
individual sectors to prevent program or erase operations within that
sector
– Sectors can be locked and unlocked in-system at VCC level
Hardware Sector Protection
– All sectors locked when VPP = VIL
Handshaking feature
– Provides host system with minimum possible latency by monitoring
RDY
Supports Common Flash Memory
Interface (CFI)
Manufactured on 65 nm MirrorBit process technology
Cycling endurance: 100,000 cycles per sector typical
Data retention: 10 years typical
Data# Polling and toggle bits
– Provides a software method of detecting program and erase
operation completion
Erase Suspend/Resume
– Suspends an erase operation to read data from, or program data to,
a sector that is not being erased, then resumes the erase operation
Program Suspend/Resume
– Suspends a programming operation to read data from a sector other
than the one being programmed, then resume the programming
operation
Packages
– 44-ball Very Thin FBGA
Performance Characteristics
S29VS/XS-R MirrorBit
Flash Family
S29VS064R, S29XS064R
64 Megabit (4M x 16-bit), CMOS 1.8 Volt-Only Simultaneous
Read/Write, Multiplexed, Burst Mode Flash Memory
Data Sheet (Advance Information)
Read Access Times
Speed Option (MHz)
108
Max. Synch. Latency, ns (tIACC)
80
Max. Synch. Burst Access, ns (tBACC)
7.6
Max. Asynch. Access Time, ns (tACC)80
Max OE# Access Time, ns (tOE)15
Current Consumption (typical values)
Continuous Burst Read @ 108 MHz
32 mA
Simultaneous Operation @ 108 MHz
71 mA
Program/Erase
30 mA
Standby Mode
20 A
Typical Program & Erase Times
Single Word Programming
170 s
Effective Write Buffer Programming (VCC) Per Word
14.1 s
Effective Write Buffer Programming (VPP) Per Word
9 s
Sector Erase (8 kword Sector)
350 ms
Sector Erase (32 kword Sector)
800 ms