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參數(shù)資料
| 型號(hào)： | S29NS064N0SBJW002 |
| 廠商： | SPANSION LLC |
| 元件分類： | DRAM |
| 英文描述： | Simultaneous Read/Write, Multiplexed, Burst Mode Flash Memory |
| 中文描述： | 4M X 16 FLASH 1.8V PROM, 80 ns, PBGA44 |
| 封裝： | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 |
| 文件頁(yè)數(shù)： | 79/86頁(yè) |
| 文件大小： | 1036K |
| 代理商： | S29NS064N0SBJW002 |
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S29NS-N_00_A12 June 13, 2006
S29NS-N MirrorBit Flash Family
77
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
22. Physical Dimensions (S29NS256N)
22.1
VDC048—48-Ball Very Thin Fine-Pitch Ball Grid Array (FBGA) 11 x 10 mm
Package
*For reference only. BSC is an ANSI standard for Basic Space Centering
PACKAGE
VDC 048
JEDEC
N/A
9.95 mm x 10.95 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
0.86
---
1.00
OVERALL THICKNESS
A1
0.20
---
---
BALL HEIGHT
A2
0.66
0.71
0.76
BODY THICKNESS
D
9.85
9.95
10.05
BODY SIZE
E
10.85
10.95
11.05
BODY SIZE
D1
4.50
BALL FOOTPRINT
E1
1.50
BALL FOOTPRINT
MD
10
ROW MATRIX SIZE D DIRECTION
ME
4
ROW MATRIX SIZE E DIRECTION
N
φ
b
e
48
TOTAL BALL COUNT
0.25
0.30
0.35
BALL DIAMETER
0.50
BALL PITCH
SD / SE
0.25
SOLDER BALL PLACEMENT
3241 \ 16-038.9h.aa01
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8.
NOT USED.
9.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
INDEX MARK
A1 CORNER
NF4
NF1
NF8
1
2
4
3
5
6
8
9
7
NF2
NF3
A
B
C
D
NF7
NF5
10
NF6
D
A
10
E
A1 CORNER
SE
7
E1
D1
e
1.00
1.00
7
SD
B
6
φ
b
C
M
C
M
φ
0.05
φ
0.15
A
1.00
1.00
C
0.10
C
0.08
A
B
C
A2
SEATING PLANE
A1
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| S29NS128N0PBJW002 | Simultaneous Read/Write, Multiplexed, Burst Mode Flash Memory |
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| S29NS064N0SBJW003 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Simultaneous Read/Write, Multiplexed, Burst Mode Flash Memory |
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| S29NS128J0LBAW000 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Burst Mode Flash Memories |
| S29NS128J0LBAW002 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Burst Mode Flash Memories |
| S29NS128J0LBAW003 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Burst Mode Flash Memories |
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