參數(shù)資料
型號(hào)： S29CD032G0RQFI012
廠商： SPANSION LLC
元件分類： PROM
英文描述： 1M X 32 FLASH 2.7V PROM, 48 ns, PQFP80
封裝： LEAD FREE, PLASTIC, MO-108CB-1, QFP-80
文件頁(yè)數(shù)： 79/81頁(yè)
文件大?。?/td> 1276K
代理商： S29CD032G0RQFI012
78
S29CD-G Flash Family
S29CD-G_00_B1 March 3, 2009
Data
Sheet
(Pre limin ar y)
Changed tCH to tCLKH and changed values
Removed tDS, tDH, tAS, tAH, tCS
Added tWADVH, tWCKS
Erase/Program Operations
Removed tWCKS
Alternative CE# Controlled Erase/Program Operations
Added tWADVH
Added tWCKS
28.2.2
Revision B0 (November 14, 2005)
Absolute Maximum Ratings
Changed under/overshoot to ± 2.0V
Changed Vcc, VIO values
Changed Address, Data, Control Signal values
Note 5 & 6
Revision History
Added in previous revision histories.
Erase/Program Operations
Added Note 1 to tWC and tVCS
Global
Changed SecSi to Secured Silicon.
28.2.3
Revision B1 (March 3, 2009)
Global
Added obsolescence information.
相關(guān)PDF資料
PDF描述
S29CL032J0JFAM020 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0JFFM020 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0RFAM012 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80
S29GL032A10TAIR11 Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: High Voltage; Unmarked
S29GL032A10TAIR21 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S29CD032J0MQAN010 制造商:Spansion 功能描述:
S29CD032J0MQFM010U 制造商:Spansion 功能描述:N/A - Trays
S29CD032J0PFAM010 制造商:Spansion 功能描述:
S29CD032J0PQFI010 制造商:Spansion 功能描述:AUTO 3.3V 512KX32 FLASH - Trays
S29CL016J0JQFM030 制造商:Spansion 功能描述:FLASH PARALLEL 3.3V 16MBIT 512KX32 54NS 80PQFP - Trays
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