參數(shù)資料
型號(hào): S2009
廠商: Applied Micro Circuits Corp.
英文描述: 1.6 Gbps Quad Serial Backplane Device(用于高速串行數(shù)據(jù)傳送的1.6 Gbps四串行收發(fā)器)
中文描述: 1.6 Gbps的四串行背板設(shè)備(用于高速串行數(shù)據(jù)傳送的1.6 Gbps的四串行收發(fā)器)
文件頁數(shù): 32/42頁
文件大?。?/td> 1866K
代理商: S2009
32
1.6 GBPS QUAD SERIAL BACKPLANE DEVICE
S2009
February 9, 2001 / Revision C
Figure 12. Compact 23 mm x 23 mm 208 Pin TBGA Package
Thermal Management
e
g
a
k
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c
e
a
w
P
o
x
P
a
M
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A
Θ
a
Θ
c
W
4
6
M
P
F
L
0
0
2
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C
9
1
W
/
C
0
Note: The S2009 requires an airflow of 200 Linear Feet Per Minute (LFPM) for proper
thermal management.
Θ
ja value corresponds to a 200 LFPM environment.
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參數(shù)描述
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