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參數(shù)資料
| 型號： | RTL8801 |
| 英文描述： | Specifications |
| 中文描述： | 規(guī)格 |
| 文件頁數(shù)： | 18/19頁 |
| 文件大?。?/td> | 318K |
| 代理商： | RTL8801 |
RTL8801
Preliminary
1999/3
18
Note:
1.To be determined at seating plane -c-
2.Dimensions D
1
and E
1
do not include mold
Symbol
Dimension in
inch
Dimension in
mm
protrusion. D
1
and E
1
are maximum plastic body
Min Nom Max Min Nom Max
size dimensions including mold mismatch.
A
-
-
0.067
-
-
1.70
3.Dimension b does not include dambar protrusion.
A
1
0.000 0.004 0.008 0.00
0.1
0.20
Dambar can not be located on the lower radius of the foot.
A
2
0.051 0.055 0.059 1.30
1.40
1.50
4.Exact shape of each corner is optional.
b
0.006 0.009 0.011
0.
15
0.22
0.29
5.These dimensions apply to the flat section of the lead
b
1
0.006 0.008 0.010 0.15
0.20
0.25
between 0.10 mm and 0.25 mm from the lead tip.
c
0.004
-
0.008 0.09
-
0.20
6. A
1
is defined as the distance from the seating plane
c
1
0.004
-
0.006 0.09
-
0.16
to the lowest point of the package body.
D
0.472 BSC
12.00 BSC
7.Controlling dimension : millimeter.
D
1
0.394 BSC
10.00 BSC
8. Reference document : JEDEC MS-026 , BBC
E
0.472 BSC
12.00 BSC
TITLE : 64LD LQFP ( 10x10x1.4mm)
E
1
0.394 BSC
10.00 BSC
PACKAGE OUTLINE DRAWING , FOOTPRINT 2.0mm
e
0.020 BSC
0.50 BSC
LEADFRAME MATERIAL:
L
0.016 0.024 0.031 0.40 0.60 0.80
APPROVE
DOC. NO.
L
1
0.039 REF
0
°
0
°
12
°
TYP
12
°
TYP
1.00 REF
0
°
0
°
12
°
TYP
12
°
TYP
VERSION
1
3.5
°
9
°
3.5
°
9
°
PAGE
OF
1
-
-
-
-
CHECK
DWG NO.
LQ064 - P1
2
DATE
NOV. 06.1997
3
REALTEK SEMI-CONDUCTOR CO., LTD
REALTEK Semiconductor Co., Ltd.
reserved all rights of this document. No part of this
document may be copied or reproduced in any form or by any means or transferred to any third
party without the prior written consent of
REALTEK Semiconductor Co., Ltd. REALTEK
reserves the right to change products or specifications without notice. This document has been
carefully checked and is believed to be accurate. However
REALTEK Semiconductor Co., Ltd.
assumes no responsibility for inaccuracies.
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