參數(shù)資料
型號(hào)： RM5261
廠商： PMC-Sierra, Inc.
英文描述： RM5261⑩ Microprocessor with 64-Bit System Bus Data Sheet Released
中文描述： RM5261⑩微處理器與64位系統(tǒng)總線的數(shù)據(jù)資料發(fā)布
文件頁(yè)數(shù)： 37/40頁(yè)
文件大小： 683K
代理商： RM5261
Proprietary and Confidential to PMC-Sierra, Inc and for its Customer
’
s Internal Use
Document ID: PMC-2002241, Issue 1
37
RM5261
Microprocessor with 64-Bit System Bus Data Sheet
Released
aaa
0.08
ThetaJa
13.7
°
C/W
1.5
°
C/W
ThetaJc
Symbol
208PQ4
Note
Min
Nominal
Max
Notes
1.
2.
All dimensioning and tolerances confirm to ASME Y14.5
–
1994.
Datum Plane H located at the bottom of the mold parting line and coincident with where lead exits plastic
body.
Datums A
–
B and D to be determined where center line between leads exits plastic body at Datum Plane
H.
To be determined at seating Plane C.
Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.254 MM per side.
Dimension D1 and E1 do include mold mismatch and are determined at Datum Plane H.
“
N
”
is number of terminals.
Package top dimensions are smaller than bottom dimensions by 0.20 millimeters and top of package will
not overhang bottom of package.
Dimensions b does not include Damabr protrusion. Allowable Damabr protrusion shall be 0.08 MM. Total
in excess of b dimension at maximum material condition. Damabr can not be located on the lower radius
or the foot. The dimension space between protrusion and an adjacent lead shall not be less than 0.07 MM
for 0.4 MM and 0.50 MM pitch package.
All dimensions are in millimeters.
10. The optional exposed heat shrink is coincident with the top or bottom side of the package and not allowed
to protrude beyond that surface.
11. These dimensions apply to the flat section of the lead between 0.10 MM and 0.25 MM from the lead tip.
12. This drawing conforms to JEDEC registered outline MS-029. But the heat slug dimension was not
specified on JEDEC.
13. A1 is defined as the distance from the seating plane to the lowest point of the package body.
3.
4.
5.
6.
7.
8.
9.
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