參數(shù)資料
型號(hào)： RF2469
廠商： RF MICRO DEVICES INC
元件分類(lèi)： 無(wú)繩電話(huà)/電話(huà)
英文描述： W-CDMA AND PCS LOW NOISE AMPLIFIER/MIXER DOWNCONVERTER
中文描述： TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC20
封裝： 4 X 4 MM, LCC-20
文件頁(yè)數(shù)： 1/18頁(yè)
文件大?。?/td> 255K
代理商： RF2469
8-33
8
F
Preliminary
Produc t Desc ription
Ordering Information
Typic al Applic ations
Features
Func tional Block Diagram
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs HBT
Si Bi-CMOS
SiGe HBT
GaAs MESFET
Si CMOS
19
L
18
V
17
V
16
E
14
LNA2
BYP
13
GND
12
VCC1
10
I
I
9
8
M
7
G
5
LNA2 IN
4
VCC1
3
VCC1
2
GND
1
LNA1 OUT
20
G
L
6
11
LO IN
15
LNA1 BYP
Logic
Control
RF2469
W-CDMA AND PCS LOW NOISE
AMPLIFIER/MIX ER DOWNCONVER T ER
W-CDMA Handsets
PCS Handsets
General Purpose Downconverter
Commercial and Consumer Systems
Portable Battery-Powered Equipment
The RF2469 is a receiver front-end designed for the
receive section of W-CDMA and PCS applications. It is
designed to amplify and downconvert RF signals while
providing 23dB of stepped gain control range and fea-
tures digital control of the LNA gain and mixer gain. A fur-
ther feature of the chip is adjustable IIP3 of the LNA and
mixer using an off-chip current setting resistor. Noise Fig-
ure, IP3, and other specs are designed to be compatible
with W-CDMA and PCS communications. The IC is man-
ufactured on an advanced Gallium Arsenide Heterojunc-
tion
Bipolar
Transistor
(GaAs
packaged in a 20-pin, leadless chip carrier with an
exposed die flag.
HBT)
process
and
Complete Receiver Front-End
Stepped LNA/Mixer Gain Control
Adjustable LNA/Mixer Bias Current
23dB Maximum Cascade Gain
2.5dB Noise Figure at Maximum
Cascade Gain
RF2469
W-CDMA and PCS Low Noise Amplifier/Mixer Down-
converter
Fully Assembled Evaluation Board
RF2469 PCBA
8
Rev A5 010717
1.00
0.90
4.00
sq.
0.60
0.24 typ
3
0.20
0.75
0.50
0.23
0.13
4 PLCS
0.50
2.10
sq.
0.65
4 PLCS
0.05
12°
MAX
Dimensions in mm.
Note orientation of package.
NOTES:
Shaded lead is Pin 1.
1
Package Warpage: 0.05 mm max.
Die Thickness Allowable: 0.305 mm max.
4
5
Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
2
Dimension applies to plated terminal: to be measured between 0.02 mm
and 0.25 mm from terminal end.
3
Package S tyle: LCC , 20-Pin, 4 x 4
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