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參數(shù)資料
| 型號： | RF2483 |
| 廠商： | RF MICRO DEVICES INC |
| 元件分類： | 無繩電話/電話 |
| 英文描述： | LOW NOISE DUAL-BAND QUADRATURE MODULATOR WITH AGC |
| 中文描述： | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC20 |
| 封裝： | 4 X 4 MM, ROHS COMPLIANT, QFN-20 |
| 文件頁數(shù)： | 1/20頁 |
| 文件大小： | 423K |
| 代理商： | RF2483 |
5-29
5
M
U
Preliminary
Produc t Desc ription
Ordering Information
Typic al Applic ations
Features
Func tional Block Diagram
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs HBT
Si Bi-CMOS
SiGe HBT
GaAs MESFET
Si CMOS
*
*
*
*
*
Represents "GND".
3
ISIG P
2
VCC2
1
VCC3
4
ISIG N
5
EN
V
6
7
L
8
G
9
L
10
G
11 BAND SEL
12 QSIG N
13 QSIG P
14 VREF
15 GC DEC
16
G
17
R
18
G
19
R
20
G
Σ
Mode
Control
&
Biasing
Power
Control
+45°
-45°
+45°
-45°
RF2483
LOW NOISE DUAL-BAND QUADR AT UR E
MODULAT OR WIT H AGC
TDMA/GSM/EDGE Handsets
GSM/EDGE Handsets
W-CDMA Handsets
TDMA-Based Wireless Applications
Wireless Local Loop
Basestations
The RF2483 is a dual-band direct I/Q to RF modulator
designed for handset applications where multiple modes
of operation are required. The device provides common
differential I/Q inputs and a common AGC amplifier. Inde-
pendent single-ended LO inputs and single-ended high
and low band RF outputs are provided. The device
achieves a very low out-of-band noise density of
-156dBm/Hz minimizing RF filtering. Operating from a
single 2.7V supply, the device is packaged in a
4mmx4mm, 20-pin, plastic leadless chip carrier.
Dual-Band Operation 700-2200MHz
-156dBm/Hz noise@20MHz offset
+19dBm OIP3
+6dBm OP1dB
35dB Gain Control Range
Single 2.7V to 3.3V Supply
RF2483
Low Noise Dual-Band Quadrature Modulator with
AGC
Fully Assembled Evaluation Board
RF2483 PCBA
5
Rev A2 010904
1.85
1.55 sq.
.60
.24 typ
.30
.18
3
.75
.50
.50
.23
.13
4 PLCS
.05
.01
12°
max
1.00
0.85
.80
.65
4.00
sq.
NOTES:
Shaded Pin is Lead 1.
1
Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
Package Warpage: 0.05 mm max.
Die Thickness Allowable: 0.305 mm max.
4
5
2
Dimension applies to plated terminal: to be measured between 0.02
mm and 0.25 mm from terminal end.
3
.65
.30
4 PLCS
Package S tyle: LCC , 20-Pin, 4 x 4
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| RF2483_06 | 制造商:RFMD 制造商全稱:RF Micro Devices 功能描述:LOW NOISE DUAL-BAND QUADRATURE MODULATOR WITH AGC |
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