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參數(shù)資料
| 型號： | RBO40-40T |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO |
| 中文描述： | REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO |
| 文件頁數(shù)： | 12/15頁 |
| 文件大?。?/td> | 166K |
| 代理商： | RBO40-40T |
PowerSo-10package mountedon
R
th
(j-a)
P Diss
1.FR4 using therecommendedpad-layout
50
°
C/W
1.5 W
2.FR4 withheatsinkon board(6cm
2
)
35
°
C/W
2.0 W
3.FR4 withcopper-filledthroughholes and externalheatsinkapplied
12
°
C/W
5.8 W
4. IMSfloating inair (40cm
2
)
8
°
C/W
8.8 W
5. IMSwith externalheatsinkapplied
3.5
°
C/W
20 W
TABLE1
A new technology available today is IMS - an
Insulated Metallic Substrate. This offers greatly
enhanced thermal characteristics for surface
mount components. IMS is a substrateconsisting
of threedifferentlayers,(I)thebasematerialwhich
is availableas an aluminium or a copper plate,(II)
a thermal conductive dielectrical layer and (III) a
copper foil, which can be etched as a circuitlayer.
Using this material a thermalresistance of 8
°
C/W
with 40 cm
2
of board floating in air is achievable
(seefig.4).If evenhigherpower isto be dissipated
an externalheatsink could be appliedwhich leads
to an R
th
(j-a) of 3.5
°
C/W (see Fig. 5), assuming
that
R
th
(heatsink-air)
(junction-heatsink). This is commonly applied in
practice,
leading
to
dimensions. Often power devices are defined by
is
equal
to
R
th
reasonable
heatsink
consideringthe maximum junction temperatureof
the device. In practice , however, this is far from
being exploited. A summary of various power
managementcapabilities is made in table1 based
on a reasonabledelta T of 70
°
Cjunctionto air.
The PowerSO-10 concept also represents an
attractive alternative to C.O.B. techniques.
PowerSO-10 offers devices fully tested at low
and high temperature. Mounting is simple - only
conventionalSMT is required - enabling the users
to getrid ofbond wireproblemsandtheproblemto
controlthe hightemperaturesoftsolderingaswell.
An optimized thermal managementis guaranteed
through PowerSO-10 as the power chips must in
any case be mounted on heat spreaders before
beingmountedonto the substrate.
Fig.4 :
Mountingon metalbackedboard
Fig. 5 :
Mounting on metal backed board with an
externalheatsinkapplied
FR4board
Copperfoil
Aluminium
heatsink
Copper foil
Insulation
Aluminium
RBO40-40G / RBO40-40M / RBO40-40T
12/15
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| RBO40-40G | REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO |
| RBO40-40M | REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO |
| RC-RSA-H-100-M | ROD ACTUATOR. H100 AND CABLE |
| RC-RSA-H-200-M | ROD ACTUATOR. H200 AND CABLE |
| RC-RSA-H-300-M | ROD ACTUATOR. H300 AND CABLE |
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