參數(shù)資料
型號(hào)： RBO40-40T
廠(chǎng)商： 意法半導(dǎo)體
英文描述： REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO
中文描述： REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO
文件頁(yè)數(shù)： 10/15頁(yè)
文件大小： 166K
代理商： RBO40-40T
SOLDERINGRECOMMENDATION
The
soldering
process causes
thermal stress to a semiconductor component.
This has to be minimized to assure a reliableand
extended lifetime of the device. The PowerSO-10
package
can
be
exposed to
temperatureof 260
°
C for 10 seconds. However a
proper soldering of the package could be done at
215
°
C for 3 seconds. Any solder temperature
profile should be within these limits. As reflow
techniquesaremost commoninsurfacemounting,
typical heating profiles are given in Figure 1,either
for mounting on FR4 or on metal-backed boards.
For each particular board, the appropriate heat
profile has to be adjusted experimentally. The
present proposal is just a starting point. In any
case, the following precautions have to be
considered:
- alwayspreheatthe device
- peaktemperatureshould be at least30
°
C
higherthanthe meltingpointof thesolder
alloychosen
considerable
a
maximum
- thermalcapacityof thebase substrate
Voids pose a difficult reliability problem for large
surface mount devices. Such voids under the
package result in poor thermal contact and the
high thermal resistance leads to component
failures. The PowerSO-10 is designed from
scratch to be solely a surface mount package,
hence symmetry in the x- and y-axis gives the
package excellent weight balance. Moreover, the
PowerSO-10offersthe uniquepossibilityto control
easily the flatness and quality of the soldering
process. Both the top and the bottom soldered
edges of the package are accessible for visual
inspection(soldering meniscus).
Coplanarity between the substrate and
package can be easily verified. The quality of the
solder joints is very important for two reasons : (I)
poor quality solder joints result directly in poor
reliability
and (II) solder thickness affects the
thermal resistance significantly. Thus a tight
control of this parameter results in thermally
efficientandreliablesolder joints.
the
Fig. 1 :
Typicalreflow solderingheatprofile
Time (s)
Temperature ( C)
0
40
80
120
160
200
240
280
320
360
0
50
100
150
200
250
o
215 C
Soldering
Preheating
Cooling
245 C
Epoxy FR4
board
Metal-backed
board
RBO40-40G / RBO40-40M / RBO40-40T
10/15
相關(guān)PDF資料
PDF描述
RBO40-40G REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO
RBO40-40M REVERSEDBATTERYAND OVERVOLTAGEPROTECTIONCIRCUITRBO
RC-RSA-H-100-M ROD ACTUATOR. H100 AND CABLE
RC-RSA-H-200-M ROD ACTUATOR. H200 AND CABLE
RC-RSA-H-300-M ROD ACTUATOR. H300 AND CABLE
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