參數(shù)資料
型號: PPC440GX-3CF400C
廠商: APPLIEDMICRO INC
元件分類: 微控制器/微處理器
英文描述: Power PC 440GX Embedded Processor
中文描述: 32-BIT, 400 MHz, RISC PROCESSOR, CBGA552
封裝: 25 X 25 MM, CERAMIC, FBGA-552
文件頁數(shù): 90/93頁
文件大?。?/td> 794K
代理商: PPC440GX-3CF400C
440GX – Power PC 440GX Embedded Processor
90
AMCC
Revision 1.15 – August 30, 2007
Data Sheet
Revision Log
Date
Contents of Modification
08/07/2002
Add revision log.
08/30/2002
Change EMC0:1TxD0:1 and EMC0:1TxEn T
OV
from 15 to 11 ns.
09/25/2002
Update for L2 cache
10/22/2002
Add heat sink mounting information .
11/20/2002
Update I/O timing data.
01/07/2003
Update PCI-X I/O voltage specification.
Correct package drawing
01/22/2003
Correct description of SysReset signal.
Update for 533MHz parts and add power supply current values.
03/25/2003
Update DDR SDRAM timing.
Change RTBIxTX and RX control signals to data signals.
06/16/2003
Add 667MHz part numbers, update I/O specifications, and fill in missing data points.
07/15/2003
Update information concerning higher speed parts, bus clock ratios, the duplicate trace signals, and initialization
strapping pins. Update Ethernet signals with new and moved signals.
07/17/2003
Remove IBM Confidential.
12/02/2003
Revise DDR SDRAM I/O section.
01/13/2004
Correct TrcTS6 signal data (pin assignment and multiplexing).
02/12/2004
Restore V
DD
/OV
DD
voltage sequence restriction.
02/25/2004
Add three Revision C part numbers.
03/04/2004
Update part number list.
Update dimensions on package drawing.
03/25/2004
Correct GMCTxClk signal description from input-only to I/O.
05/12/2004
Add plastic package data, new power data, and update part number list.
05/20/2004
Upgrade 533MHz ceramic part to 105
°
C rating.
06/15/2004
Correct dimensions on ceramic package drawing.
06/30/2004
Replace misssing 533MHz C temperature range part.
11/01/2004
Add information on minimum SysClk and TRST duration during power-on reset.
Remove power sequence restrictions note from Absolute Maximum Rating table.
Restate power sequencing restrictions in Recommended DC Operating Conditions table.
Convert to AMCC format.
12/09/2004
Restore “Preliminary” to document classification.
06/16/2005
Add S (no L2 cache support) temperature range part numbers.
07/01/2005
Add reduced-lead ceramic and lead-free plastic part numbers.
10/17/2005
Clarify DDR SDRAM interface diagram.
11/07/2005
Remove metal-layer specification from technology description.
Add logo and number nomenclature to package drawing.
12/22/2005
Update I/O timing specs for EMC0:3TxD, GMC0RxD0:3, GMC1RxD0:3, GMCRxDV, GMC1RxCtl, GMCRxD0:7,
GMCRxEr, GMCCrS, GMCTxD0:7.
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參數(shù)描述
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