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參數(shù)資料
| 型號(hào)： | PM75RSK060 |
| 廠商： | POWEREX INC |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | Intellimod⑩ Module Three Phase Brake IGBT Inverter Output (75 Amperes/600 Volts) |
| 中文描述： | AC MOTOR CONTROLLER, 150 A, DMA25 |
| 封裝： | POWER MODULE-25 |
| 文件頁(yè)數(shù)： | 31/31頁(yè) |
| 文件大?。?/td> | 925K |
| 代理商： | PM75RSK060 |
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Sep.1998
6.8
Handling Precautions for
Intelligent Power Modules
Electrical Considerations:
I.
Apply proper control voltages
and input signals before static
testing.
II.
Carefully check wiring of con-
trol voltage sources and input
signals. Miswiring may destroy
the integrated gate control cir-
cuit.
III. When measuring leakage cur-
rent always ramp the curve
tracer voltage up from zero.
Ramp voltage back down be-
fore disconnecting the device.
Never apply a voltage greater
than the V
CES
rating
of the device.
IV. When measuring saturation
voltage low inductance test fix-
tures must be used. Inductive
surge voltages can exceed de-
vice ratings.
Mechanical Considerations:
I.
Avoid mechanical shock. The
module uses ceramic isolation
that can be cracked if the mod-
ule is dropped.
II.
Do not bend the power termi-
nals. Lifting or twisting the
power terminals may cause
stress cracks in the copper.
III. Do not over torque terminal or
mounting screws. Maximum
torque specifications are pro-
vided in device data sheets.
IV. Avoid uneven mounting stress.
A heatsink with a flatness of
0.001"/1" or better is recom-
mended. Avoid one sided tight-
ening stress. Figure 6.48
shows the recommended
torquing order for mounting
screws. Uneven mounting can
cause the modules ceramic
isolation to crack.
Thermal Considerations:
I.
Do not put the module on a hot
plate. Externally heating the
module's base plate at a rate
greater than 15
°
C/min. will
cause thermal stress that may
damage the module.
II.
When soldering to the signal
pins and fast on terminals
avoid excessive heat. The sol-
dering time and temperature
should not exceed 230
°
C for
5 seconds.
III. Maximize base plate to
heatsink contact area for good
heat transfer. Use a thermal in-
terface compound such as
white silicon grease. The
heatsink should have a surface
finish of 64 microinches or
less.
Figure 6.48
Mounting Screws Torque Order
2
1
4
1
2
3
MITSUBISHI SEMICONDUCTORS POWER MODULES MOS
USING INTELLIGENT POWER MODULES
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