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參數(shù)資料
| 型號(hào)： | PM75RSK060 |
| 廠商： | POWEREX INC |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | Intellimod⑩ Module Three Phase Brake IGBT Inverter Output (75 Amperes/600 Volts) |
| 中文描述： | AC MOTOR CONTROLLER, 150 A, DMA25 |
| 封裝： | POWER MODULE-25 |
| 文件頁數(shù)： | 28/31頁 |
| 文件大小： | 925K |
| 代理商： | PM75RSK060 |
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Sep.1998
6.6.4 Connecting the
Interface Circuit
The input pins of Mitsubishi Intelli-
gent Power Modules are designed
to be connected directly to a
printed circuit board. Noise pick up
can be minimized by building the
interface circuit on the PCB near
the input pins of the module. Low
power modules have tin plated
control and power pins that are de-
signed to be soldered directly to
the PCB. Higher power modules
have gold plated pins that are de-
signed to be connected to the PCB
using an inverse mounted header
receptacle. An example of this con-
nection for a dual type IPM is
shown in Figure 6.44. This connec-
tion technique can also be adapted
to large six and seven pack mod-
ules. Table 6.7 shows the sug-
gested connection method and
connector for each Third Genera-
tion IPM.
Table 6.8 shows the suggested
connection method and connector
for V-Series IPMs. Figure 6.45
shows the PCB layout for V-Series
six and seven pack connector.
Figure 6.44
Connection of the Interface Circuit
A
B
C
D
E
Hole for Header receptacle pin
Clearance Hole for IPM pin
Clearance Hole for IPM guide pin
IPM pin spacing
Header Receptacle Pin Spacing
.040" Typ.
.070" Typ.
.090" Typ.
0.10" Typ.
per connector mfg.
A
C
B
SIDE VIEW
END VIEW
E
D
HEADER RECEPTACLE
PRINTED CIRCUIT BOARD
IPMS GUIDE PINS
C
1
PCB LAYOUT EXAMPLE FOR DUAL TYPE 3RD GENERATION IPM
Table 6.7 Third Generation IPM Connection Methods
Third Generation Intelligent Power Module Type
Connection Method
PM10CSJ060, PM15CSJ060, PM20CSJ060,
PM30CSJ060, PM30RSF060, PM50RSK060,
PM10RSH120, PM15RSH120
Solder to PCB
PM50RSA060, PM75RSA060, PM100CSA060,
PM100RSA060, PM150CSA060, PM150RSA060, Receptacle
PM200CSA060, PM25RSB120, PM50RSA120,
PM75CSA120, PM100CSA120
31 Position 2mm Inverse Header
Hirose P/N: DF10-31S-2DSA (59)
PM200DSA060, PM300DSA060, PM400DSA060, 5 Position 2.54mm (0.1") Inverse
PM600DSA060, PM75DSA120, PM100DSA120,
PM150DSA120, PM200DSA120, PM300DSA120, Method P/N: 1000-205-2105
PM400HSA120, PM600HSA120
Header Receptacle
Hirose P/N: MDF7-5S-2.54DSA
MITSUBISHI SEMICONDUCTORS POWER MODULES MOS
USING INTELLIGENT POWER MODULES
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PM75RVA060 | 功能描述:MOD IPM HF 600V 75A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動(dòng)器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊 |
| PM75RVA060_05 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE |
| PM75RVA060_11 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE |
| PM75-XXXK | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SMT POWER INDUCTORS |
| PM761 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
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