參數(shù)資料
型號: PIP250M
英文描述: Integrated buck converter
中文描述: 集成的降壓轉(zhuǎn)換器
文件頁數(shù): 16/19頁
文件大?。?/td> 334K
代理商: PIP250M
Philips Semiconductors
PIP250M
Integrated buck converter
Product data
Rev. 02 — 21 February 2003
16 of 19
9397 750 10904
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
15.2 Solder paste printing
The process of printing the solder paste requires care because of the fine pitch and
small size of the solder lands. A stencil thickness of 0.125 mm is recommended. The
stencil apertures can be made the same size as the PCB lands in
Figure 15
.
The type of solder paste recommended for HVQFN packages is “No clean”, Type 3,
due to the difficulty of cleaning flux residues from beneath the package.
Fig 15. PCB footprint for SOT687-1 package (reflow soldering).
0.4 SP (2
×
)
11.15 OA
(2
×
)
7.6 Cu
(2
×
)
10.8 Cu
(2
×
)
0.9 SP
(10
×
)
0.5 SP
(4
×
)
1 SP
(10
×
)
8.9 Cu
(2
×
)
1 SP
(8
×
)
1 SP
(8
×
)
0.28 Cu (68
×
)
0.4 SP
0.4 SP
0.6 Cu
4.1
8.63 OA
(4
×
)
4.1
0.6 Cu
e = 0.5
MGW820
solder lands
Cu pattern
clearance
solder paste
occupied area
0.1
0.2
0.025
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