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參數(shù)資料
| 型號： | PIP250M |
| 英文描述： | Integrated buck converter |
| 中文描述： | 集成的降壓轉(zhuǎn)換器 |
| 文件頁數(shù)： | 14/19頁 |
| 文件大?。?/td> | 334K |
| 代理商： | PIP250M |
Philips Semiconductors
PIP250M
Integrated buck converter
Product data
Rev. 02 — 21 February 2003
14 of 19
9397 750 10904
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
14. Soldering
14.1 Introduction to soldering HVQFN packages
The HVQFN package is a near Chip Scale Package (CSP) with a copper lead frame.
It is a leadless package, where electrical contact to the printed circuit board is made
through metal pads on the underside of the package. In addition to the small pads
around the periphery of the package, there are large pads on the underside that
provide low thermal resistance, low electrical resistance, low inductance connections
between the power components inside the package and the PCB. It is this feature of
the HVQFN package that makes it ideally suited for low voltage, high current DC to
DC converter applications.
Electrical connection between the package and the printed circuit board is made by
printing solder paste on the printed circuit board, placing the component and
reflowing the solder in a convection or infra-red oven. The solder reflow process is
shown in
Figure 13
and the typical temperature profile is shown in
Figure 14
. To
ensure good solder joints, the peak temperature T
p
should not exceed 220
°
C, and
the time above liquidus temperature should be less than 1.25 minutes. The ramp rate
during preheat should not exceed 3 K/s. Nitrogen purge is recommended during
reflow.
Fig 13. Typical reflow soldering process flow.
Fig 14. Typical reflow soldering temperature profile.
SOLDER PASTE
PRINTING
POST PRINT
INSPECTION
COMPONENT
PLACEMENT
PRE REFLOW
INSPECTION
REFLOW SOLDERING
POST REFLOW INSPECTION
(PREFERABLY X-RAY)
REWORK AND
TOUCH UP
03aj25
03aj26
0
100
200
300
0
1
2
3
time (minutes)
Temp
(
°
C)
Tr
Te
Tp
rate of rise of
temperature < 3 K/s
1 min max
1.25 min max
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PIP250M,518 | 功能描述:IC REG BUCK SYNC ADJ 15A 68HVQFN RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關(guān)穩(wěn)壓器 系列:- 標準包裝:20 系列:SIMPLE SWITCHER® 類型:降壓（降壓） 輸出類型:固定 輸出數(shù):1 輸出電壓:12V 輸入電壓:4 V ~ 60 V PWM 型:電壓模式 頻率 - 開關(guān):52kHz 電流 - 輸出:1A 同步整流器:無 工作溫度:-40°C ~ 125°C 安裝類型:通孔 封裝/外殼:16-DIP（0.300"，7.62mm） 包裝:管件 供應(yīng)商設(shè)備封裝:16-DIP 其它名稱:*LM2575HVN-12LM2575HVN-12 |
| PIP26U | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Fibers can be free cut using fiber cutter |
| PIP30 | 制造商:Microsemi Corporation 功能描述:TVS SGL BI-DIR 42.5V 7.5KW 2PIN CASE 11 - Bulk 制造商:ProTek Devices 功能描述:Suppressor Assembly 30V 7.5KW |
| PIP3101-A,127 | 功能描述:MOSFET RAIL TOPFET2 RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS（導通）:0.014 Ohms 配置:Single 最大工作溫度: 安裝風格:Through Hole 封裝 / 箱體:Max247 封裝:Tube |
| PIP3102-R | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:LOGIC LEVEL TOPFET |
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