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參數資料
| 型號： | PCA9549 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Octal bus switch with individually I2C-bus controlled enables |
| 中文描述： | 個別八路與I2C總線開關，總線控制，使 |
| 文件頁數： | 22/24頁 |
| 文件大?。?/td> | 126K |
| 代理商： | PCA9549 |
PCA9549_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 11 July 2006
22 of 24
Philips Semiconductors
PCA9549
Octal bus switch with individually I
2
C-bus controlled enables
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Abbreviations
16. Revision history
Table 12.
Acronym
CBT
CDM
DUT
ESD
HBM
I
2
C
MM
PCB
SMBus
TTL
Abbreviations
Description
Cross Bar Technology
Charged Device Model
Device Under Test
ElectroStatic Discharge
Human Body Model
Inter Integrated Circuit
Machine Model
Printed-Circuit Board
System Management Bus
Transistor-Transistor Logic
Table 13.
Document ID
PCA9549_1
Revision history
Release date
20060711
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
相關PDF資料 |
PDF描述 |
|---|---|
| PCA9555N | 16-bit I2C and SMBus I/O port with interrupt |
| PCA9555 | 16-bit I2C and SMBus I/O port with interrupt |
| PCA9556 | Octal SMBus Registered Interface(八位SM總線寄存接口) |
| PCA9556PW | Octal SMBus Registered Interface |
| PCA9557 | 8-bit I2C and SMBus I/0 port with reset |
相關代理商/技術參數 |
參數描述 |
|---|---|
| PCA9549BS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Octal bus switch with individually I2C-bus controlled enables |
| PCA9549BS,118 | 功能描述:數字總線開關 IC 8-BIT I2C BUS SWITCH RoHS:否 制造商:Texas Instruments 開關數量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
| PCA9549BS-T | 功能描述:數字總線開關 IC 8-BIT I2C BUS SWITCH W/RESET RoHS:否 制造商:Texas Instruments 開關數量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
| PCA9549D | 功能描述:數字總線開關 IC 8-BIT I2C BUS SWITCH W/RESET RoHS:否 制造商:Texas Instruments 開關數量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
| PCA9549D,112 | 功能描述:數字總線開關 IC 8-BIT I2C BUS SWITCH RoHS:否 制造商:Texas Instruments 開關數量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
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