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參數資料
| 型號： | PCA9549 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Octal bus switch with individually I2C-bus controlled enables |
| 中文描述： | 個別八路與I2C總線開關，總線控制，使 |
| 文件頁數： | 20/24頁 |
| 文件大?。?/td> | 126K |
| 代理商： | PCA9549 |
PCA9549_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 11 July 2006
20 of 24
Philips Semiconductors
PCA9549
Octal bus switch with individually I
2
C-bus controlled enables
14. Soldering
14.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215
°
C to 260
°
C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
Table 9.
SnPb eutectic process - package peak reflow temperatures (from J-STD-020C
July 2004)
Package thickness
Volume mm
3
< 350
< 2.5 mm
240
°
C + 0/
5
°
C
≥
2.5 mm
225
°
C + 0/
5
°
C
Volume mm
3
≥
350
225
°
C + 0/
5
°
C
225
°
C + 0/
5
°
C
Table 10.
Pb-free process - package peak reflow temperatures (from J-STD-020CJuly
2004)
Package thickness
Volume mm
3
< 350
Volume mm
3
350 to
2000
260
°
C + 0
°
C
250
°
C + 0
°
C
245
°
C + 0
°
C
Volume mm
3
> 2000
< 1.6 mm
1.6 mm to 2.5 mm
≥
2.5 mm
260
°
C + 0
°
C
260
°
C + 0
°
C
250
°
C + 0
°
C
260
°
C + 0
°
C
245
°
C + 0
°
C
245
°
C + 0
°
C
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相關代理商/技術參數 |
參數描述 |
|---|---|
| PCA9549BS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Octal bus switch with individually I2C-bus controlled enables |
| PCA9549BS,118 | 功能描述:數字總線開關 IC 8-BIT I2C BUS SWITCH RoHS:否 制造商:Texas Instruments 開關數量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
| PCA9549BS-T | 功能描述:數字總線開關 IC 8-BIT I2C BUS SWITCH W/RESET RoHS:否 制造商:Texas Instruments 開關數量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
| PCA9549D | 功能描述:數字總線開關 IC 8-BIT I2C BUS SWITCH W/RESET RoHS:否 制造商:Texas Instruments 開關數量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
| PCA9549D,112 | 功能描述:數字總線開關 IC 8-BIT I2C BUS SWITCH RoHS:否 制造商:Texas Instruments 開關數量:24 傳播延遲時間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
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