
9397 750 14318
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 6 April 2005
22 of 25
Philips Semiconductors
PCA9546A
4-channel I
2
C switch with reset
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Abbreviations
16. Revision history
Table 10:
Acronym
CDM
ESD
HBM
IC
LSB
MM
MSB
PCB
Abbreviations
Description
Charged Device Model
Electro Static Discharge
Human Body Model
Integrated Circuit
Least Significant Bit
Machine Model
Most Significant Bit
Printed-Circuit Board
Table 11:
Document ID
PCA9546A_3
Modifications:
Revision history
Release date
20050406
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
Section 2 “Features” on page 1
:
–
7th bullet: changed ‘RDS
ON
’ to ‘R
on
’
–
16th bullet: changed ‘JESDEC’ to ‘JEDEC’
Figure 4 “Pin configuration for HVQFN16 (transparent top view)” on page 4
:
–
added pin 1 indicator notch and center pad
–
changed pin 1 from ‘A2’ to ‘RESET’
Section 6.2 “Pin description” on page 5
: added
Table note 1
and its reference at HVQFN pin 6.
Section 7.2.1 “Control register definition” on page 6
, third sentence: changed ‘The 2 LSBs of the
control byte ...’ to ‘The 4 LSBs of the control byte ...’
Section 7.5 “Voltage translation” on page 7
:
–
Figure 7
modified and title changed from ‘V
pass
voltage versus V
DD
’ to ‘Pass gate voltage versus
supply voltage’
–
2nd paragraph: changed symbol ‘V
pass
’ and ‘V
pass(max)
’ to ‘V
o(sw)
’ and ‘V
o(sw)(max)
’, respectively.
Data sheet status
Product data sheet
Change notice
-
Doc. number
9397 750 14318
Supersedes
PCA9546A_2