參數(shù)資料
型號: PCA9546A
廠商: NXP Semiconductors N.V.
英文描述: 4-channel I2C switch with reset
中文描述: 4通道的I2C開關(guān)與復(fù)位
文件頁數(shù): 20/25頁
文件大?。?/td> 144K
代理商: PCA9546A
9397 750 14318
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 6 April 2005
20 of 25
Philips Semiconductors
PCA9546A
4-channel I
2
C switch with reset
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215
°
C to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
for all BGA, HTSSON..T and SSOP..T packages
for packages with a thickness
2.5 mm
for packages with a thickness < 2.5 mm and a volume
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9546A_1 制造商:TI 制造商全稱:Texas Instruments 功能描述:4-CHANNEL I2C AND SMBus SWITCH WITH RESET FUNCTION
PCA9546A_2 制造商:TI 制造商全稱:Texas Instruments 功能描述:4-CHANNEL I2C AND SMBus SWITCH WITH RESET FUNCTION
PCA9546A_3 制造商:TI 制造商全稱:Texas Instruments 功能描述:4-CHANNEL I2C AND SMBus SWITCH WITH RESET FUNCTION
PCA9546ABS 制造商:NXP Semiconductors 功能描述:
PCA9546ABS,118 功能描述:多路器開關(guān) IC I2C SWITCH 4CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻(最大值):7 Ohms 開啟時(shí)間(最大值): 關(guān)閉時(shí)間(最大值): 傳播延遲時(shí)間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16