參數(shù)資料
型號(hào)： PCA9506
廠商： NXP Semiconductors N.V.
英文描述： 40-bit I2C-bus I/O port with RESET, OE, and INT
中文描述： 40位I2C總線的I / O端口復(fù)位，光電，和INT
文件頁(yè)數(shù)： 26/30頁(yè)
文件大小： 145K
代理商： PCA9506
9397 750 14939
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 14 February 2006
26 of 30
Philips Semiconductors
PCA9506
40-bit I
2
C-bus I/O port with RESET, OE, and INT
15. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be totally safe, it is desirable to take precautions appropriate to handling MOS
devices. Advice can be found in Data Handbook IC24 under “Handling MOS devices”
16. Soldering
16.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
16.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215
°
C to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
16.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9506BS 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:40-bit I2C-bus I/O port with RESET, OE and INT
PCA9506BS,118 功能描述:接口-I/O擴(kuò)展器 I/O EXPANDER I2C RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9506BS,118-CUT TAPE 制造商:NXP 功能描述:PCA9506 Series 40-Bit I2C-Bus I/O Port with RESET OE and INT - HVQFN - 56
PCA9506DGG 功能描述:接口-I/O擴(kuò)展器 I/O EXPANDER I2C RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9506DGG,512 功能描述:接口-I/O擴(kuò)展器 I/O EXPANDER I2C RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
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