參數(shù)資料
型號(hào)： PCA8802U/2AA/1
廠商： NXP SEMICONDUCTORS
元件分類： 模擬信號(hào)調(diào)理
英文描述： SPECIALTY ANALOG CIRCUIT, PBGA8
封裝： 1.19 X 1.14 MM, 0.22 MM HEIGHT, LEAD FREE, WLCSP-8
文件頁(yè)數(shù)： 24/34頁(yè)
文件大?。?/td> 160K
代理商： PCA8802U/2AA/1
PCA8802_1
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 19 February 2009
30 of 34
NXP Semiconductors
PCA8802
Smartcard RTC
For further information on temperature proles, refer to application note
AN10365
“Surface mount reow soldering description”.
16.3.1 Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefcient) differences between substrate and chip.
16.3.2 Quality of solder joint
A ip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reow can occur during the reow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
16.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
MSL: Moisture Sensitivity Level
Fig 36. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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