參數(shù)資料
型號(hào)： PCA8802U/2AA/1
廠(chǎng)商： NXP SEMICONDUCTORS
元件分類(lèi)： 模擬信號(hào)調(diào)理
英文描述： SPECIALTY ANALOG CIRCUIT, PBGA8
封裝： 1.19 X 1.14 MM, 0.22 MM HEIGHT, LEAD FREE, WLCSP-8
文件頁(yè)數(shù)： 22/34頁(yè)
文件大?。?/td> 160K
代理商： PCA8802U/2AA/1
PCA8802_1
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 19 February 2009
29 of 34
NXP Semiconductors
PCA8802
Smartcard RTC
16. Soldering of WLCSP packages
16.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
16.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reow soldering itself
16.3 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 36) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classied in accordance with Table 16.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 36.
Table 16.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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