參數(shù)資料
型號(hào)： PC33899CVW
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 運(yùn)動(dòng)控制電子
英文描述： BRUSH DC MOTOR CONTROLLER, PDSO30
封裝： ROHS COMPLIANT, HSOP-30
文件頁(yè)數(shù)： 22/26頁(yè)
文件大?。?/td> 990K
代理商： PC33899CVW
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33899
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Protected Power Supply Voltage
VIGNP
-0.3 to 40
V
Logic Supply Voltage
VCC
-0.3 to 7.0
V
Logic Output Bias Voltage
VDDQ
-0.3 to 7.0
V
VCCL Supply Voltage
VCCL
-0.3 to 5.0
V
Input/Output Voltage (FWD, REV, EN1, EN2, PWM, CS, DI, SCLK, DO, CSNS,
LSCMP, RS, REDIS)
VI/O
-0.3 to 7.0
V
Motor Outputs
VS0, VS1
-0.5 to 40
V
Charge Pump Voltage
VCRES
-0.3 to 50
V
Human Body Model
Machine Model
VESD1
VESD2
±1500
±200
V
THERMAL RATINGS
Operating Temperature(2)
Ambient
Junction
TA
TJ
-40 to 125
-40 to 150
°C
Storage Temperature
TSTG
-65 to 150
°C
Thermal Resistance, Junction to Ambient(3)
RθJA
18
°C/W
Thermal Resistance, Junction to Case (Exposed Pad)
RθJC
<0.5
°C/W
Peak Package Reflow Temperature During Solder Mounting(4)
TSOLDER
220
°C
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100pF, RZAP = 1500Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200pF, RZAP = 0Ω).
2.
The junction temperature is the primary limiting parameter. The module thermal design must provide a low enough thermal impedance
to keep the junction temperature within limits for all anticipated power levels and ambient temperatures.
3.
RθJA is referenced to the JEDEC standard 2s2p thermal evaluation board at 1W total device power dissipation in still air. Deviations from
this standard will produce corresponding changes in the actual thermal performance.
4.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
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