參數(shù)資料
型號(hào): NB6L56MNG
廠商: ON Semiconductor
文件頁(yè)數(shù): 4/10頁(yè)
文件大?。?/td> 0K
描述: IC MUX 2.5V/3.3V DUAL DIFF 32QFN
標(biāo)準(zhǔn)包裝: 74
系列: ECLinPS MAX™
類(lèi)型: 扇出緩沖器(分配),多路復(fù)用器,數(shù)據(jù)
電路數(shù): 2
比率 - 輸入:輸出: 2:1
差分 - 輸入:輸出: 是/是
輸入: CML,LVDS,LVPECL
輸出: LVPECL
頻率 - 最大: 2.5GHz
電源電壓: 2.375 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 32-QFN(5x5)
包裝: 管件
NB6L56
http://onsemi.com
3
Figure 3. NB6L56 Pinout: QFN32 (Top View)
1
2
3
4
5
6
7
8
9
10
11
12
1314
1516
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
NB6L56
INB0
VTB0
VREFACB0
INB0
INB1
GND
VCC
QB
SELB
NC
VCC
VTB1
VREFACB1
VCC
QB
GND
VCC
QA
VCC
INA1
VREF
ACA1
VT
A1
INA1
INA0
NC
SELA
VREF
ACA0
VT
A0
Exposed Pad (EP)
Table 1. PIN DESCRIPTION
Pin
Name
I/O
Pin Description
1, 4
5, 8
25, 28
29, 32
INB0, INB0
INB1, INB1
INA0, INA0
INA1, INA1
LVPECL, CML,
LVDS Input
Noninverted, Inverted Differential Input pairs (Note 1). Default state is
indeterminate if left floating open. Do not connect unused input pairs with
one input connected to VCC and the complementary input to GND. For
differential and single ended interface, see “Interface Applications”.
2, 6
26, 30
VTB0, VTB1
VTA0, VTA1
Internal 100 W Centertapped Termination Pin for Differential Input pairs
(Figure 4)
3
7
27
31
VREFACB0
VREFACB1
VREFACA0
VREFACA1
Output Voltage Reference for CapacitorCoupled Inputs or Single
Ended Interface (see “Interface Applications”)
15
18
SELB
SELA
LVTTL /
LVCMOS Input
Input Select pin; LOW for IN0 Inputs, HIGH for IN1 Inputs; defaults HIGH
when left open
14, 19
NC
No Connect
10, 13,16,17
20, 23
VCC
Power
Positive Supply Voltage. All VCC pins must be connected to the positive
power supply for correct DC and AC operation.
11, 12
21, 22
QB, QB
QA, QA
LVPECL
Output
Inverted, Noninverted Differential Outputs Note 1.
9, 24
GND
Ground
Negative Supply Voltage, connected to Ground
EP
The Exposed Pad (EP) on the package bottom is thermally connected to
the die for improved heat transfer out of package. The exposed pad must
be attached to a heatsinking conduit. The pad is connected to the die
and must only be connected electrically to GND on the PC board.
1. If no signal is applied on any INxn input pair, the device will be susceptible to selfoscillation.
2. All VCC and GND pins must be externally connected to a power supply for proper operation.
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