參數(shù)資料
型號: MTP2P50E
廠商: ON SEMICONDUCTOR
元件分類: 功率晶體管
英文描述: Power MOSFET 2 Amps, 500 Volts
中文描述: 2 A, 500 V, 6 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-220AB
封裝: CASE 221A-09, 3 PIN
文件頁數(shù): 5/8頁
文件大小: 103K
代理商: MTP2P50E
MTP2P50E
http://onsemi.com
5
DRAIN–TO–SOURCE DIODE CHARACTERISTICS
0.6
1
1.4
1.8
2.4
VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
I
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
RG, GATE RESISTANCE (OHMS)
1000
t
tr
tf
td(off)
td(on)
VGS = 0 V
TJ = 25
°
C
Figure 8. Gate–To–Source and Drain–To–Source
Voltage versus Total Charge
300
V
250
200
150
0
10
6
0
QT, TOTAL CHARGE (nC)
V
12
8
2
4
2
4
6
8
10
12
14
16
18
20
100
50
0
VDD = 250 V
ID = 2 A
VGS = 10 V
TJ = 25
°
C
100
10
1
10
100
2
1.6
1.2
0.8
0.4
0
0.8
1.2
1.6
Q1
Q2
QT
VDS
Q3
2
2.2
VGS
ID = 2 A
TJ = 25
°
C
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain–to–source voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (TC) of 25
°
C.
Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed
in
AN569,
Resistance–General Data and Its Use.”
Switching between the off–state and the on–state may
traverse any load line provided neither rated peak current
(IDM) nor rated voltage (VDSS) is exceeded and the
transition time (tr,tf) do not exceed 10
μ
s. In addition the total
power averaged over a complete switching cycle must not
exceed (TJ(MAX) – TC)/(R
θ
JC).
A Power MOSFET designated E–FET can be safely used
in switching circuits with unclamped inductive loads. For
“Transient
Thermal
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and adjusted for operating conditions
differing from those specified. Although industry practice is
to rate in terms of energy, avalanche energy capability is not
a constant. The energy rating decreases non–linearly with an
increase of peak current in avalanche and peak junction
temperature.
Although many E–FETs can withstand the stress of
drain–to–source avalanche at currents up to rated pulsed
current (IDM), the energy rating is specified at rated
continuous current (ID), in accordance with industry
custom. The energy rating must be derated for temperature
as shown in the accompanying graph (Figure 12). Maximum
energy at currents below rated continuous ID can safely be
assumed to equal the values indicated.
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