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參數(shù)資料
| 型號(hào)： | MTB50N06V |
| 廠商： | MOTOROLA INC |
| 元件分類： | JFETs |
| 英文描述： | TMOS POWER FET 42 AMPERES 60 VOLTS |
| 中文描述： | 42 A, 60 V, 0.028 ohm, N-CHANNEL, Si, POWER, MOSFET |
| 文件頁(yè)數(shù)： | 2/10頁(yè) |
| 文件大?。?/td> | 289K |
| 代理商： | MTB50N06V |
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS
(TJ = 25
°
C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 0.25 mAdc)
Temperature Coefficient (Positive)
V(BR)DSS
60
—
—
69
—
—
Vdc
mV/
°
C
Zero Gate Voltage Drain Current
(VDS = 60 Vdc, VGS = 0 Vdc)
(VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150
°
C)
Gate–Body Leakage Current (VGS =
±
20 Vdc, VDS = 0)
IDSS
—
—
—
—
10
100
μ
Adc
IGSS
—
—
100
nAdc
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(VDS = VGS, ID = 250
μ
Adc)
Temperature Coefficient (Negative)
VGS(th)
2.0
—
2.7
3.0
4.0
—
Vdc
mV/
°
C
Static Drain–Source On–Resistance (VGS = 10 Vdc, ID = 21 Adc)
Drain–Source On–Voltage (VGS = 10 Vdc)
(ID = 42 Adc)
(ID = 21 Adc, TJ = 150
°
C)
RDS(on)
VDS(on)
—
0.025
0.028
Ohm
—
—
1.4
—
1.7
1.6
Vdc
Forward Transconductance (VDS = 6.25 Vdc, ID = 20 Adc)
gFS
16
23
—
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
f = 1.0 MHz)
Ciss
Coss
Crss
—
1644
2320
pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
—
465
660
Reverse Transfer Capacitance
—
112
230
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
RG = 9.1
)
td(on)
tr
td(off)
tf
—
12
20
ns
Rise Time
(VDD = 25 Vdc, ID = 42 Adc,
VGS = 10 Vdc,
—
122
250
Turn–Off Delay Time
—
64
110
Fall Time
—
54
90
Gate Charge
(See Figure 8)
VGS = 10 Vdc)
QT
Q1
Q2
Q3
—
47
70
nC
(VDS = 48 Vdc, ID = 42 Adc,
—
9
—
—
21
—
—
16
—
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage (1)
(IS = 42 Adc, VGS = 0 Vdc)
(IS = 42 Adc, VGS = 0 Vdc, TJ = 150
°
C)
VSD
—
—
1.06
0.99
2.5
—
Vdc
Reverse Recovery Time
(See Figure 14)
dIS/dt = 100 A/
μ
s)
trr
ta
—
84
—
ns
(IS = 42 Adc, VGS = 0 Vdc,
—
73
—
tb
—
11
—
Reverse Recovery Stored Charge
QRR
—
0.28
—
μ
C
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from contact screw on tab to center of die)
(Measured from the drain lead 0.25
″
from package to center of die)
LD
—
—
3.5
4.5
—
—
nH
Internal Source Inductance
(Measured from the source lead 0.25
″
from package to source bond pad)
LS
—
7.5
—
nH
(1) Pulse Test: Pulse Width
≤
300
μ
s, Duty Cycle
≤
2%.
(2) Switching characteristics are independent of operating junction temperature.
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