參數(shù)資料
型號(hào)： MT48V16M16LFFG
廠商： Micron Technology, Inc.
英文描述： MOBILE SDRAM
中文描述： 移動(dòng)SDRAM
文件頁(yè)數(shù)： 57/58頁(yè)
文件大?。?/td> 1451K
代理商： MT48V16M16LFFG
57
256Mb: x16 Mobile SDRAM
MobileRamY26L_A.p65 – Pub. 5/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2002, Micron Technology, Inc.
256Mb: x16
MOBILE SDRAM
ADVANCE
(Bottom View)
FBGA “FG” PACKAGE
54-pin, 8mm x 14mm
BALL A1 ID
1.00 MAX
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: .27mm
14.00 ±0.10
BALL A1
BALL A9
BALL A1 ID
0.80 TYP
0.80 TYP
1.80 ±0.05
CTR
7.00 ±0.05
8.00 ±0.10
4.00 ±0.05
3.20 ±0.05
3.20 ±0.05
0.700 ±0.075
0.155 ±0.013
SEATING PLANE
C
6.40
6.40
0.10 C
54X
0.35
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS 0.33
C
L
C
L
NOTE:
1. All dimensions are in millimeters.
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