參數(shù)資料
型號(hào)： MPM22CUC450B
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 450 MHz, MICROPROCESSOR, XMA
封裝： MMC-2
文件頁數(shù)： 58/64頁
文件大?。?/td> 778K
代理商： MPM22CUC450B
Pentium
III Processor Mobile Module MMC-2
245304-004
Datasheet
55
7.0
Thermal Specification
7.1
Thermal Design Power
The power handling capability of the system thermal solution may be reduced to less than the
recommended typical Thermal Design Power (TDP) as shown in Table 27 with the implementation
of firmware/software control or "throttling” that reduces the CPU power consumption and
dissipation. The typical TDP is the typical power dissipation under normal operating conditions at
nominal V_CORE (CPU power supply) while executing the worst case power instruction mix. This
includes the power dissipated by all of the relevant components. During all operating
environments, the processor junction temperature, TJ, must be within the specified range of 0
° C to
100
° C.
Table 27. Thermal Design Power Specification
NOTES:
1. During all operating environments, the processor temperature, Tj, must be within the special range of 0 °C to
100
°C.
2. TDPModule is a thermal-solution design reference point for thermal solution readiness for total module power.
Symbol
Parameter
Typical
450 MHz
Typical
500 MHz
Notes
TDP Module
Module Thermal Design Power
14.1W
15.0W
Module = core + 82443BX +
voltage regulator
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