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參數(shù)資料
| 型號： | MPE603RRX300LX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 19/28頁 |
| 文件大小： | 418K |
| 代理商： | MPE603RRX300LX |
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26
EC603e Microprocessor Hardware Specifications (PID7t), Rev. 2.0
MOTOROLA
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (Rsa) versus airow
velocity is shown in Figure 15.
Figure 15. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 C/W, thus
Tj = 30C + 5C + (0.095 C/W +1.0 C/W + 7 C/W) * 3.0 W,
resulting in a die-junction temperature of approximately 60 C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakeeld Engineering, and Aavid
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need air ow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common gure-
of-merit used for comparing the thermal performance of various microelectronic packaging technologies,
one should exercise caution when only using this metric in determining thermal management because no
single parameter can adequately describe three-dimensional heat ow. The nal die-junction operating
temperature, is not only a function of the component-level thermal resistance, but the system-level design
and its operating conditions. In addition to the component's power consumption, a number of factors affect
the nal operating die-junction temperatureairow, board population (local heat ux of adjacent
components), heat sink efciency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection and
conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models for
the board, as well as, system-level designs. To expedite system-level thermal analysis, several compact
thermal-package models are available within FLOTHERM¨. These are available upon request.
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0.5
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3.5
Thermalloy #2328B Pin-fin Heat Sink
Approach Air Velocity (m/s)
Heat
Sink
Thermal
Resistance
(C/W)
(25 x28 x 15 mm)
2
4
6
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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