參數(shù)資料
型號: MPC8349EZUAJF
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 533 MHz, RISC PROCESSOR, PBGA672
封裝: 35 X 35 MM, 1.50 MM HEIGHT, 1 MM PITCH, TBGA-672
文件頁數(shù): 102/115頁
文件大?。?/td> 1228K
代理商: MPC8349EZUAJF
MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
87
Thermal
19.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction to case
thermal resistance.
TJ = TC + (RθJA × PD)
where:
TC = case temperature of the package (°C)
RθJC = junction to case thermal resistance (°C/W)
PD = power dissipation (W)
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