參數(shù)資料
型號: MPC8349EZUAJF
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 533 MHz, RISC PROCESSOR, PBGA672
封裝: 35 X 35 MM, 1.50 MM HEIGHT, 1 MM PITCH, TBGA-672
文件頁數(shù): 100/115頁
文件大小: 1228K
代理商: MPC8349EZUAJF
MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
85
Thermal
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Table 57. Heat Sinks and Junction-to-Case Thermal Resistance of MPC8349E (TBGA)
Heat Sink Assuming Thermal Grease
Air Flow
35x35 mm TBGA
Junction-to-Ambient
Thermal Resistance
AAVID 30x30x9.4 mm Pin Fin
Natural Convention
10
AAVID 30x30x9.4 mm Pin Fin
1 m/s
6.5
AAVID 30x30x9.4 mm Pin Fin
2 m/s
5.6
AAVID 31x35x23 mm Pin Fin
Natural Convention
8.4
AAVID 31x35x23 mm Pin Fin
1 m/s
4.7
AAVID 31x35x23 mm Pin Fin
2 m/s
4
Wakefield, 53x53x25 mm Pin Fin
Natural Convention
5.7
Wakefield, 53x53x25 mm Pin Fin
1 m/s
3.5
Wakefield, 53x53x25 mm Pin Fin
2 m/s
2.7
MEI, 75x85x12 no adjacent board, extrusion
Natural Convention
6.7
MEI, 75x85x12 no adjacent board, extrusion
1 m/s
4.1
MEI, 75x85x12 no adjacent board, extrusion
2 m/s
2.8
MEI, 75x85x12 mm, adjacent board, 40 mm Side bypass
1 m/s
3.1
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