參數(shù)資料
型號(hào)： MPC8240LZU200X
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 200 MHz, RISC PROCESSOR, PBGA352
封裝： 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352
文件頁(yè)數(shù)： 33/58頁(yè)
文件大?。?/td> 596K
代理商： MPC8240LZU200X
MPC8240 Integrated Processor Hardware Specications
39
System Design Information
1.7.8 PCI Reference Voltage - LVdd
The MPC8240’s PCI reference voltage (LVdd) pins should be connected to 3.3 ± 0.3 V power supply if
interfacing the MPC8240 into a 3.3 V PCI bus system. Similarly, the LVdd pins should be connected to 5.0
± 5% V power supply if interfacing the MPC8240 into a 5V PCI bus system. For either reference voltage,
the MPC8240 always performs 3.3V signaling as described in the PCI Local Bus Specication (r2.1). The
MPC8240 only tolerates 5V signals when interfaced into a 5V PCI bus system.
1.7.9 Thermal Management Information
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent upon the system-level
design—the heat sink, airow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods: adhesive, spring clip to holes in the printed-circuit
board or package and mounting clip and screw assembly. See Figure 25:
Figure 25. Package Exploded Cross-Sectional View with Several Heat Sink Options
Figure 26 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the TBGA package and there exists high board-level thermal loading
of adjacent components.
A heat sink is not attached to the TBGA package and there exists low board-level thermal loading
of adjacent components.
A heat sink (e.g. ChipCoolers #HTS255-P) is attached to the TBGA package and there exists high
board-level thermal loading of adjacent components.
A heat sink (e.g. ChipCoolers #HTS255-P) is attached to the TBGA package and there exists low
board-level thermal loading of adjacent components.
Adhesive
or
Thermal Interface
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
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MPC8241LVR266D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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