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參數(shù)資料
| 型號： | MPC755BPX300LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360 |
| 封裝： | 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 |
| 文件頁數(shù)： | 30/48頁 |
| 文件大?。?/td> | 1265K |
| 代理商： | MPC755BPX300LX |
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36
MPC755 RISC Microprocessor Hardware Specifications
System Design Information
especially while driving large capacitive loads. This noise must be prevented from reaching other
components in the MPC755 system, and the MPC755 itself requires a clean, tightly regulated source of
power. Therefore, it is recommended that the system designer place at least one decoupling capacitor at each
Vdd, OVdd, and L2OVdd pin of the MPC755. It is also recommended that these decoupling capacitors
receive their power from separate Vdd, (L2)OVdd, and GND power planes in the PCB, utilizing short traces
to minimize inductance.
These capacitors should have a value of 0.01 F or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0508 or 0603 orientations where
connections are made along the length of the part.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the Vdd, L2OVdd, and OVdd planes, to enable quick recharging of the smaller chip capacitors.
These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick
response time necessary. They should also be connected to the power and ground planes through two vias
to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS tantalum or Sanyo OSCON).
1.8.5 Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level through a resistor. Unused active low inputs should be tied to OVdd. Unused active high inputs should
be connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external Vdd, OVdd, L2OVdd, and GND pins of the
MPC755.
1.8.6 Output Buffer DC Impedance
The MPC755 60x and L2 I/O drivers are characterized over process, voltage, and temperature. To measure
Z0, an external resistor is connected from the chip pad to (L2)OVdd or GND. Then, the value of each resistor
is varied until the pad voltage is (L2)OVdd/2 (See Figure 23).
The output impedance is the average of two components, the resistances of the pull-up and pull-down
devices. When Data is held low, SW2 is closed (SW1 is open), and RN is trimmed until the voltage at the
pad equals (L2)OVdd/2. RN then becomes the resistance of the pull-down devices. When Data is held high,
SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals (L2)OVdd/2. RP then
becomes the resistance of the pull-up devices.
Figure 23 describes the driver impedance measurement circuit described above.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC755BPX350LE | 功能描述:微處理器 - MPU 360PBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BRX300LE | 功能描述:微處理器 - MPU 360CBGARV2.8HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BRX350LE | 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BRX350TE | 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC755BVT300LE | 功能描述:微處理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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