參數(shù)資料
型號(hào)： MPC755BPX300LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360
封裝： 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360
文件頁(yè)數(shù)： 22/48頁(yè)
文件大?。?/td> 1265K
代理商： MPC755BPX300LX
MPC755 RISC Microprocessor Hardware Specifications
29
Package Description
1.7 Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC745, 255
PBGA package, as well as the MPC755 360 CBGA and PBGA packages. While both the MPC755 plastic
and the ceramic packages are described here, both packages are not guaranteed to be available at the same
time. All new designs should allow for either ceramic or plastic BGA packages for this device. For more
information on designing a common footprint for both plastic and ceramic package types, see the document
“Motorola
Flip-Chip
Plastic
Ball
Grid
Array
Presentation”,
available
on
the
web
at
http://www.mot.com/SPS/PowerPC/teksupport/teklibrary. The MPC755 was initially sampled in a CBGA
package, but production units are currently provided in both a CBGA and a PBGA package. Because of the
better long-term device-to-board interconnect reliability of the PBGA package, Motorola recommends use
of a PBGA package except where circumstances dictate use of a CBGA package.
1.7.1 Package Parameters for the MPC745 PBGA
The package parameters are as provided in the following list. The package type is 21 x 21 mm, 255-lead
plastic ball grid array (PBGA).
Package outline
21 x 21 mm
Interconnects
255 (16 x 16 ball array – 1)
TSIZ[0:2]
A9, B9, C9
High
Output
OVdd
TT[0:4]
C10, D11, B12, C12, F11
High
I/O
OVdd
WT
C3
Low
Output
OVdd
VDD
G8, G10, G12, J8, J10, J12, L8, L10, L12, N8,
N10, N12
——
2.0 V
VOLTDET
K13
High
Output
L2OVdd
8
Notes:
1. OVdd supplies power to the processor bus, JTAG, and all control signals except the L2 cache controls (L2CE,
L2WE, and L2ZZ); L2OVDD supplies power to the L2 cache interface (L2ADDR[0:16], L2DATA[0-63], L2DP[0:7]
and L2SYNC_OUT) and the L2 control signals; and Vdd supplies power to the processor core and the PLL and
DLL (after filtering to become AVDD and L2AVDD respectively). These columns serve as a reference for the
nominal voltage supported on a given signal as selected by the BVSEL/L2VSEL pin configurations of Table 2 and
the voltage supplied. For actual recommended value of Vin or supply voltages see Table 3.
2. These are test signals for factory use only and must be pulled up to OVdd for normal machine operation.
3. This pin must be pulled up to OVdd for proper operation of the processor interface. To allow for future I/O voltage
changes, provide the option to connect BVSEL independently to either OVDD or to GND.
4. These pins are reserved for potential future use as additional L2 address pins.
5. Uses one of nine existing no-connects in MPC750 360 BGA package.
6. Internal pull up on die.
7. This pin must be pulled up to L2OVdd for proper operation of the processor interface. To allow for future I/O
voltage changes, provide the option to connect L2VSEL independently to either L2OVDD or to GND.
8. Internally tied to L2OVDD in the MPC755 360 BGA package to indicate the power present at the L2 cache
interface. This signal is not a power supply input.
Caution: This differs from the MPC745 255 BGA package.
Table 15. Pinout Listing for the MPC755, 360 BGA Package (Continued)
Signal Name
Pin Number
Active
I/O
I/F Voltage1
Notes
相關(guān)PDF資料
PDF描述
MPC755BRX400LX 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC755BRX450LE 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
MPC755CPX400 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
MPC755BVT300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360
MPC745BVT300 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC755BPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BRX300LE 功能描述:微處理器 - MPU 360CBGARV2.8HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BRX350LE 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BRX350TE 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BVT300LE 功能描述:微處理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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