參數(shù)資料
型號： MPC745BPX350LE
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255
封裝： 21 X 21 MM, PLASTIC, BGA-255
文件頁數(shù)： 51/52頁
文件大?。?/td> 1276K
代理商： MPC745BPX350LE
8
MPC755 RISC Microprocessor Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
Table 3 provides the recommended operating conditions for the MPC755.
Table 4 provides the package thermal characteristics for the MPC755 and MPC745. The MPC755 was
initially sampled in a CBGA package, but production units are currently provided in both a CBGA and a
PBGA package. Because of the better long-term device-to-board interconnect reliability of the PBGA
package, Motorola recommends use of a PBGA package except where circumstances dictate use of a CBGA
package. The MPC745 is offered in a PBGA package only.
Table 3. Recommended Operating Conditions1
Characteristic
Symbol
Recommended Value
Unit
Notes
300 MHz, 350 MHz
400 MHz, 450 MHz
Min
Max
Min
Max
Core supply voltage
VDD
1.80
2.10
1.90
2.10
V
3
PLL supply voltage
AVDD
1.80
2.10
1.90
2.10
V
3
L2 DLL supply voltage
L2AVDD
1.80
2.10
1.90
2.10
V
3
Processor bus
supply voltage
BVSEL = 1
OVDD
2.375
2.625
2.375
2.625
V
2, 4
3.135
3.465
3.135
3.465
5
L2 bus supply
voltage
L2VSEL = 1
L2OVDD
2.375
2.625
2.375
2.625
V
2, 4
3.135
3.465
3.135
3.465
5
Input voltage
Processor bus
Vin
GND
OVDD
GND
OVDD
V
L2 bus
Vin
GND
L2OVDD
GND
L2OVDD
V
JTAG signals
Vin
GND
OVDD
GND
OVDD
V
Die-junction temperature
Tj
0
105
0
105
°C
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
2. Revisions prior to Rev. 2.8 (Rev. E) offered different I/O voltage support. For more information, refer to
3. 2.0 V nominal.
4. 2.5 V nominal.
5. 3.3 V nominal.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
MPC755
CBGA
MPC755
PBGA
MPC745
PBGA
Junction-to-ambient thermal resistance,
natural convection
RθJA
24
31
34
°C/W
1, 2
Junction-to-ambient thermal resistance,
natural convection, four-layer (2s2p) board
RθJMA
17
25
26
°C/W
1, 3
Junction-to-ambient thermal resistance,
200 ft/min airflow, single-layer (1s) board
RθJMA
18
25
27
°C/W
1, 3
相關(guān)PDF資料
PDF描述
MPC755BRX400LE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC750PRX366LE 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360
MPC750PRX400LE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC750PRX366RE 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360
MPC740PRX400LE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC745BVT300LE 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745BVT350LE 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745CPX350LE 功能描述:微處理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745CPX350LE 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 350MHZ 255-FCPBGA
MPC745CVT350LE 功能描述:微處理器 - MPU GF REV2.8@6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*