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| 型號： | MPC745BPX350LE |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255 |
| 封裝： | 21 X 21 MM, PLASTIC, BGA-255 |
| 文件頁數(shù)： | 22/52頁 |
| 文件大?。?/td> | 1276K |
| 代理商： | MPC745BPX350LE |
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MOTOROLA
MPC755 RISC Microprocessor Hardware Specifications
29
Package Description
1.7
Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC745, 255
PBGA package, as well as the MPC755, 360 CBGA and PBGA packages. While both the MPC755 plastic
and ceramic packages are described here, both packages are not guaranteed to be available at the same time.
All new designs should allow for either ceramic or plastic BGA packages for this device. For more
information on designing a common footprint for both plastic and ceramic package types, see the Motorola
Flip-Chip Plastic Ball Grid Array Presentation. The MPC755 was initially sampled in a CBGA package,
but production units are currently provided in both a CBGA and a PBGA package. Because of the better
long-term device-to-board interconnect reliability of the PBGA package, Motorola recommends use of a
PBGA package except where circumstances dictate use of a CBGA package.
1.7.1
Package Parameters for the MPC745 PBGA
The package parameters are as provided in the following list. The package type is 21
× 21 mm, 255-lead
plastic ball grid array (PBGA).
Package outline
21
× 21 mm
Interconnects
255 (16
× 16 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.25 mm
Maximum module height 2.80 mm
Ball diameter (typical)
0.75 mm (29.5 mil)
VOLTDET
K13
High
Output
L2OVDD
8
Notes:
1. OVDD supplies power to the processor bus, JTAG, and all control signals except the L2 cache controls (L2CE,
L2WE, and L2ZZ); L2OVDD supplies power to the L2 cache interface (L2ADDR[0:16], L2DATA[0:63], L2DP[0:7],
and L2SYNC_OUT) and the L2 control signals; and VDD supplies power to the processor core and the PLL and
DLL (after filtering to become AVDD and L2AVDD, respectively). These columns serve as a reference for the
nominal voltage supported on a given signal as selected by the BVSEL/L2VSEL pin configurations of Table 2 and
2. These are test signals for factory use only and must be pulled up to OVDD for normal machine operation.
3. This pin must be pulled up to OVDD for proper operation of the processor interface. To allow for future I/O voltage
changes, provide the option to connect BVSEL independently to either OVDD or GND.
4. These pins are reserved for potential future use as additional L2 address pins.
5. Uses one of nine existing no connects in MPC750, 360 BGA package.
6. Internal pull-up on die.
7. This pin must be pulled up to L2OVDD for proper operation of the processor interface. To allow for future I/O
voltage changes, provide the option to connect L2VSEL independently to either L2OVDD or GND.
8. Internally tied to L2OVDD in the MPC755, 360 BGA package to indicate the power present at the L2 cache
interface. This signal is not a power supply input.
Caution: This differs from the MPC745, 255 BGA package.
Table 15. Pinout Listing for the MPC755, 360 BGA Package (continued)
Signal Name
Pin Number
Active
I/O
I/F Voltage 1
Notes
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| MPC745BVT300LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745BVT350LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745CPX350LE | 功能描述:微處理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745CPX350LE | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 350MHZ 255-FCPBGA |
| MPC745CVT350LE | 功能描述:微處理器 - MPU GF REV2.8@6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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