- 您現在的位置：買賣IC網 > PDF目錄45353 > MPC745BPX350LE (MOTOROLA INC) 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255 PDF資料下載
參數資料
| 型號： | MPC745BPX350LE |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 350 MHz, RISC PROCESSOR, PBGA255 |
| 封裝： | 21 X 21 MM, PLASTIC, BGA-255 |
| 文件頁數： | 35/52頁 |
| 文件大?。?/td> | 1276K |
| 代理商： | MPC745BPX350LE |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁當前第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁
40
MPC755 RISC Microprocessor Hardware Specifications
MOTOROLA
System Design Information
clockwise from pin 1 (as with an IC). Regardless of the numbering, the signal placement recommended in
Figure 25 is common to all known emulators.
The QACK signal shown in Figure 24 is usually connected to the PCI bridge chip in a system and is an input
to the MPC755 informing it that it can go into the quiescent state. Under normal operation this occurs during
a low-power mode selection. In order for COP to work, the MPC755 must see this signal asserted (pulled
down). While shown on the COP header, not all emulator products drive this signal. If the product does not,
a pull-down resistor can be populated to assert this signal. Additionally, some emulator products implement
open-drain type outputs and can only drive QACK asserted; for these tools, a pull-up resistor can be
implemented to ensure this signal is deasserted when it is not being driven by the tool. Note that the pull-up
and pull-down resistors on the QACK signal are mutually exclusive and it is never necessary to populate
both in a system. To preserve correct power-down operation, QACK should be merged via logic so that it
also can be driven by the PCI bridge.
1.8.8
Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent upon the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods—adhesive, spring clip to holes in the
printed-circuit board or package, and mounting clip and screw assembly; see Figure 25. This spring force
should not exceed 5.5 pounds of force.
Figure 25 describes the package exploded cross-sectional view with several heat sink options.
Figure 25. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC755. There are
several commercially-available heat sinks for the MPC755 provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Adhesive or
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
相關PDF資料 |
PDF描述 |
|---|---|
| MPC755BRX400LE | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| MPC750PRX366LE | 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360 |
| MPC750PRX400LE | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| MPC750PRX366RE | 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360 |
| MPC740PRX400LE | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| MPC745BVT300LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745BVT350LE | 功能描述:微處理器 - MPU GF REV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745CPX350LE | 功能描述:微處理器 - MPU GF REV 2.8 105C 6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC745CPX350LE | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 350MHZ 255-FCPBGA |
| MPC745CVT350LE | 功能描述:微處理器 - MPU GF REV2.8@6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復。