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參數(shù)資料
| 型號： | MPC603PRX180LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 180 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 33/40頁 |
| 文件大?。?/td> | 156K |
| 代理商： | MPC603PRX180LX |
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PID7v-603e Hardware Specifications
39
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
During the card assembly process, no solvent can be used with the C4FP, and no more than 3 Kg of force
must be applied normal to the top of the package prior to, during, or after card assembly. Other details of
the card assembly process follow:
Solder paste
Either water soluble (for example, Alpha 1208) or no clean
Solder stencil thickness
0.152 mm
Solder stencil aperature
Width reduced to 0.03 mm from the board pad width
Placement tool
Panasonic MPA3 or equivalent
Solder reow
Infrared, convection, or vapor phase
Solder reow prole
Infrared and/or convection
Average ramp-up—0.48 to 1.8
° C/second
Time above 183
° C—45 to 145 seconds
Minimum lead temperature—200
° C
Maximum lead temperature—240
° C
Maximum C4FP temperature—245
° C
Vapor phase
Preheat (board)—60
° C to 150° C
Time above 183
° C—60 to 145 seconds
Minimum lead temperature—200
° C
Maximum C4FP temperature—220
° C
Egress temperature—below 150
° C
Clean after reow
De-ionized (D.I.) water if water-soluble paste is used
Cleaner requirements—conveyorized, in-line
Minimum of four washing chambers
— Pre-clean chamber: top and bottom sprays, minimum top-side
pressure of 25 psig, water temperature of 70
° C minimum, dwell
time of 24 seconds minimum, water is not re-used, water ow rate
of 30 liters/minute.
— Wash chamber #1: top and bottom sprays, minimum top-side
pressure of 48 psig, minimum bottom-side pressure of 44 psig,
water temperature of 62.5
° C (±2.5° C), dwell time of 48 seconds
minimum, water ow rate of 350 liters/minute.
— Wash chamber #2: top and bottom sprays, minimum top-side
pressure of 32 psig, minimum bottom-side pressure of 28 psig,
water temperature of 72.5
° C (±2.5° C), dwell time of 48 seconds
minimum, water ow rate of 325 liters/minute.
— Final rinse chamber: top and bottom sprays, minimum top-side
pressure of 25 psig, water temperature of 72.5
° C minimum, dwell
time of 24 seconds minimum, water ow rate of 30 liters/minute.
No cleaning required if “no clean solder paste” is used
Touch-up and repair
Water soluble (for example, Kester 450) or No Clean Flux
C4FP removal
Hot air rework
C4FP replace
Hand solder
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| MPC603RRX200LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX200TC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX266LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX266TC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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