參數資料
型號： MPC603PRX180LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 180 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁數： 27/40頁
文件大小： 156K
代理商： MPC603PRX180LX
PID7v-603e Hardware Specifications
33
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Notes:
1. Junction-to-ambient thermal resistance is based on measurements on single-sided printed circuit
boards per SEMI (Semiconductor Equipment and Materials International) G38-87 in natural
convection.
2. Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88
with the exception that the cold plate temperature is used for the case temperature.
The vendors who supply heat sinks are Aavid Engineering, IERC, Thermalloy, and Wakeeld Engineering.
Contact information for these vendors follows:
Thermalloy
214-243-4321
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
International Electronic Research Corporation (IERC)
818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Aavid Engineering
603-528-3400
One Kool Path
Laconic, NH 03247-0440
Wakeeld Engineering
617-245-5900
60 Audubon Rd.
Wakeeld, MA 01880
Any of these vendors can supply heat sinks with sufcient thermal performance.
1.8.6.2 IBM C4-CQFP Package
This section provides thermal management data for the 603e; this information is based on a typical desktop
conguration using a 240 lead, 32 mm x 32 mm, IBM C4-CQFP package. The heat sink used for this data
is a pinn conguration from Thermalloy, part number 2338 and a at aluminum plate with dimensions of
24 x 24 mm and 1.5 mm thickness.
1.8.6.2.1 Thermal Characteristics
The thermal characteristics for a C4-CQFP package are as follows:
Thermal resistance (junction-to-heat sink) = Rθjs or θjs = 0.03° C/Watt (junction-to-heat sink)
1.8.6.2.2 Thermal Management Example
The following example is based on a typical desktop conguration using an IBM C4-CQFP package. The
heat sink used for this data is a pinn heat sink #2338 attached to the C4-CQFP package with 2-stage epoxy.
The junction temperature can be calculated from the junction-to-ambient thermal resistance, as follows:
Junction temperature:
Tj = Ta + Rθja * P
or
Tj = Ta + (Rθjs + Rsa) * P
相關PDF資料
PDF描述
MPC603PRX200LX 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
MPC603PFE166LX 32-BIT, 166 MHz, RISC PROCESSOR, CQFP240
MPC603PFE200LX 32-BIT, 200 MHz, RISC PROCESSOR, CQFP240
MPC603PFE225LX 32-BIT, 225 MHz, RISC PROCESSOR, CQFP240
MPC603PFE233LX 32-BIT, 233 MHz, RISC PROCESSOR, CQFP240
相關代理商/技術參數
參數描述
MPC603RRX200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX200TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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