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| 型號： | MPC603PRX180LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 180 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 25/40頁 |
| 文件大小： | 156K |
| 代理商： | MPC603PRX180LX |
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PID7v-603e Hardware Specifications
31
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
In addition, the 603e has three open-drain style outputs that require pull-up resistors (weak or stronger:
4.7 K
–10 K) if they are used by the system. These signals are—APE, DPE, and CKSTP_OUT.
During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any master
and may oat in the high-impedance state for relatively long periods of time. Since the 603e must
continually monitor these signals for snooping, this oat condition may cause excessive power draw by the
input receivers on the 603e. It is recommended that these signals be pulled up through weak (10 K
) pull-
up resistors or restored in some manner by the system. The snooped address and transfer attribute inputs
are—A[0–31], AP[0–3], TT[0–4], TBST, and GBL.
The data bus input receivers are normally turned off when no read operation is in progress and do not require
pull-up resistors on the data bus.
1.8.6 Thermal Management Information
This section provides thermal management data for the 603e; the information found in the rst sub-sections
(Section 1.8.6.1.1, “Thermal Characteristics,” through Section 1.8.6.2.2, “Thermal Management Example”)
is based on a typical desktop conguration using a 240 lead, 32 mm x 32 mm, Motorola wire-bond CQFP
package and an IBM C4-CQFP package. The heat sink used for this data is a pinn conguration from
Thermalloy, part number 2338. The IBM C4-CQFP also uses a at aluminum plate with dimensions of
24 x 24 mm and 1.5 mm thickness. The data found in the subsequent sub-sections concerns 603e’s packaged
in the 255-lead 21 mm multi-layer ceramic (MLC), ceramic BGA package. Data is shown for two cases, the
exposed-die case (no heat sink) and using the Thermalloy 2338-pin n heat sink.
1.8.6.1 Motorola Wire-Bond CQFP Package
This section provides thermal management data for the 603e; this information is based on a typical desktop
conguration using a 240 lead, 32 mm x 32 mm, Motorola wire-bond CQFP package. The heat sink used
for this data is a pinn conguration from Thermalloy, part number 2338.
1.8.6.1.1 Thermal Characteristics
The thermal characteristics for a wire-bond CQFP package are as follows:
Thermal resistance (junction-to-case) = Rθjc or θjc = 2.2° C/Watt (junction-to-case)
1.8.6.1.2 Thermal Management Example
The following example is based on a typical desktop conguration using a Motorola wire-bond CQFP
package. The heat sink used for this data is a pinn heat sink #2338 attached to the wire-bond CQFP
package with thermal grease.
Figure 15 provides a thermal management example for the Motorola CQFP package.
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| MPC603RRX200LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX200TC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX266LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX266TC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC603RRX300LC | 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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