參數(shù)資料
型號(hào)： MPC603PFE233LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 233 MHz, RISC PROCESSOR, CQFP240
封裝： 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
文件頁(yè)數(shù)： 1/40頁(yè)
文件大小： 156K
代理商： MPC603PFE233LX
MPC603E7VEC/D
(Motorola Order Number)
11/96
REV 1
G522-0267-00
(IBM Order Number)
The PowerPC name, the PowerPC logotype, PowerPC 603, and PowerPC 603e are trademarks of International Business Machines
Corporation, used by Motorola under license from International Business Machines Corporation.
This document contains information on a new product under development by Motorola and IBM. Motorola and IBM reserve the right to
Motorola Inc., 1996. All rights reserved
Portions hereof International Business Machines Corporation, 1991–1996. All rights reserved
PID7v-603e
Hardw
are
Specications
change or discontinue this product without notice.
Advance Information
PowerPC 603e RISC Microprocessor Family:
PID7v-603e Hardware Specications
The PowerPC 603e microprocessor is an implementation of the PowerPC family of
reduced instruction set computing (RISC) microprocessors. In this document, the term
‘603e’ is used as an abbreviation for ‘PowerPC 603e microprocessor’. The PowerPC 603e
microprocessors are available from Motorola as MPC603e and from IBM as PPC603e.
Note that the 603e is implemented in both a 2.5-volt version (PID 0007v PowerPC 603e
microprocessor, abbreviated as PID7v-603e) and a 3.3-volt version (PID 0006 PowerPC
603e microprocessor, abbreviated as PID6-603e). This document describes the pertinent
physical characteristics of the PID7v-603e. For functional characteristics of the processor,
refer to the PowerPC 603e RISC Microprocessor User’s Manual.
This document contains the following topics:
Topic
Page
Section 1.1, “Overview”
2
Section 1.2, “Features”
3
Section 1.3, “General Parameters”
4
Section 1.4, “Electrical and Thermal Characteristics”
4
Section 1.5, “PowerPC 603e Microprocessor Pin Assignments”
17
Section 1.6, “PowerPC 603e Microprocessor Pinout Listings”
19
Section 1.7, “PowerPC 603e Microprocessor Package Descriptions”
23
Section 1.8, “System Design Information”
29
Section 1.9, “Ordering Information”
37
Appendix A, “General Handling Recommendations for the C4-CQFP Package”
38
相關(guān)PDF資料
PDF描述
MPC603PRX225LX 32-BIT, 225 MHz, RISC PROCESSOR, CBGA255
MPC603PFE240LX 32-BIT, 240 MHz, RISC PROCESSOR, CQFP240
MPC603RRX266LX 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255
MPC603RRX300TX 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
MPC603RRX200LX 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC603RRX200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX200TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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