參數(shù)資料
型號(hào): MPC603EFEX266LX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, CQFP240
封裝: 32 X 32 MM, 0.50 MM PITCH, CERAMIC, QFP-240
文件頁(yè)數(shù): 16/32頁(yè)
文件大?。?/td> 498K
代理商: MPC603EFEX266LX
PID6-603e Hardware Specifications, Rev 2
23
1.7.2.2 Mechanical Dimensions of the CBGA Package
Figure 12 provides the mechanical dimensions and bottom surface nomenclature of the CBGA package.
Figure 12. Mechanical Dimensions and Bottom Surface Nomenclature of the CBGA Package
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2.
CONTROLLING DIMENSION: MILLIMETER.
0.200
F
T
255X
A
2X
A1 CORNER
P
N
0.200
2X
– E –
123456789 10111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
E
0.300
T
0.150
D
C
H
0.150 T
B
– F –
K
G
S
– T –
DIM
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
21.000 BSC
0.827 BSC
B
21.000 BSC
0.827 BSC
C
2.450
3.000
0.096
0.118
D
0.820
0.930
0.032
0.036
G
1.270 BSC
0.050 BSC
H
0.790
0.990
0.031
0.039
K
0.635 BSC
0.025 BSC
N
5.000
16.000
0.197
0.630
P
5.000
16.000
0.197
0.630
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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