E-2
MPC565/MPC566 Reference Manual
MOTOROLA
Package
Absolute maximum ratings are stress ratings only, and functional operation at the
maximum is not guaranteed. Stress beyond those listed may affect device reliability or
cause permanent damage to the device.
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application
of any voltages higher than maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage
level (e.g., either VSS or VDD).
E.1
Package
The MPC565/MPC566 is available in packaged form. The package is a 388-ball PBGA
having a 1.0 mm ball pitch, Motorola case outline 1164-01 (See
Figure 2-7).20
Operating Temperature Range – Solder Ball
(Packaged any perimeter solder ball) 11
TSB
-40
(TL)
+135
(TH)
°C
21
Operating Temperature Range (Die Form)
TJ
-40
+150
°C
22
Storage Temperature Range
TSTG
-55
+150
°C
23
Maximum Solder Temperature 12
TSDR
—235
°C
24
Moisture Sensitivity Level 13
MSL
—
3
—
1For internal digital supply of V
DDL =2.6-V typical.
22.6 volt supply pins can withstand up to 3.6 volts for acumulative time of 24 hours over the lifetime of the de-
vice.
3During operation the value of V
FLASH must be 5.0 V ± 5%.
4V
DDA=5.0 V ±5%.
5All 2.6-V input-only pins are 5-V tolerant.
6Note that long term reliability may be compromised if 2.6-V output drivers drive a node which has been pre-
viously pulled to >3.1 V by an external component. HRESET and SRESET are fully 5-V compatible.
7Maximum continuous current on I/O pins provided the overall power dissipation is below the power dissipation
of the package. Proper operation is not guaranteed at this condition.
8Condition applies to one pin at a time.
9Transitions within the limit do not affect device reliability or cause permanent damage. Exceeding limit may
cause permanent conversion error on stressed channels and on unstressed channels.
10Maximum transient current per ISO7637.
11Maximum operating temperature on any solder ball in outer four rows of solder balls on the package. These
rows are referred to as “Perimeter Balls” to distinguish them from the thermal balls in the center of the pack-
age.
12Solder profile per CDF-AEC-Q100, current revision.
13Moisture sensitivity per JEDEC test method J-STD-020-A (April 1999).
Table E-1. Absolute Maximum Ratings (VSS = 0V) (continued)
Rating
Symbol
Min. Value
Max. Value
Unit