參數(shù)資料
型號: MPC106ARX83DG
元件分類: 總線控制器
英文描述: PCI BUS CONTROLLER, CBGA304
封裝: 21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-304
文件頁數(shù): 17/32頁
文件大?。?/td> 451K
代理商: MPC106ARX83DG
24
Tsi106 PowerPC Host Bridge Hardware Specifications Manual
80C1000_MA002_02
Package Description
1.7 Package Description
The following sections provide the package parameters and the mechanical dimensions for the Tsi106.
1.7.1 Package Parameters
The package parameters are as provided in the following list. The package type is a 21 mm x 25 mm,
304-lead C4 ceramic ball grid array (CBGA).
Package outline
21 mm x 25 mm
Interconnects
303 (16 x 19 ball array minus one)
Pitch
1.27 mm
Solder balls
10/90 Sn/Pb, 0.89 mm diameter
Maximum module height
3.16 mm
Co-planarity specification
0.15 mm
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