參數(shù)資料
型號(hào)： MCIMX281AVM4B
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 454 MHz, RISC PROCESSOR, PBGA289
封裝： 14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-289
文件頁(yè)數(shù)： 11/72頁(yè)
文件大小： 915K
代理商： MCIMX281AVM4B
i.MX28 Applications Processors Data Sheet for Automotive Products, Rev. 1
Freescale Semiconductor
19
Core via I.D: 0.068 mm, Core via plating 0.016 mm
Flag: trace style with ground balls under the die connected to the flag
Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K
Mold Compound: generic mold compound, k = 0.9 W/m K
3.3
I/O DC Parameters
This section includes the DC parameters of the following I/O types:
DDR I/O: Mobile DDR (LPDDR1), standard 1.8 V DDR2, and low-voltage 1.5 V DDR2
(LVDDR2)
General purpose I/O (GPIO)
3.3.1
DDR I/O DC Parameters
Table 23 shows the EMI digital pin DC characteristics.
NOTE
The current values and the I-V curves of the I/O DC characteristics are
estimated based on an overly conservative device model. They are updated
upon the measurement results of the first silicon.
Table 22. Thermal Resistance Data
Rating
Value
Unit
Junction to ambient1 natural convection
1 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-2 and JESD51-6. Thermal test board meets
JEDEC specification for this package.
Single layer board
(1s)
RθJA
62
°C/W
Junction to ambient1 natural convection
Four layer board (2s2p)
RθJA
36
°C/W
Junction to ambient1 (@200 ft/min)
Single layer board
(1s)
RθJMA
53
°C/W
Junction to ambient1 (@200 ft/min)
Four layer board
(2s2p)
RθJMA
33
°C/W
Junction to boards2
2 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification
for the specified package.
RθJB
24
°C/W
Junction to case (top)3
3 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is
used for the case temperature. Reported value includes the thermal resistance of the interface layer.
RθJCtop
15
°C/W
Junction to package top4
4 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
Natural Convection
Ψ
JT
3°C/W
相關(guān)PDF資料
PDF描述
MCP25020-I/P SPECIALTY MICROPROCESSOR CIRCUIT, PDIP14
MCP25050T-E/SL SPECIALTY MICROPROCESSOR CIRCUIT, PDSO14
MCP25055-I/SL SPECIALTY MICROPROCESSOR CIRCUIT, PDSO14
MCP2510T-E/P 2 CHANNEL(S), 1M bps, LOCAL AREA NETWORK CONTROLLER, PDIP18
MCZ33781EK SPECIALTY MICROPROCESSOR CIRCUIT, PDSO32
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCIMX283CVM4B 功能描述:處理器 - 專門應(yīng)用 CATSKILLS REV 1.2 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX283CVM4BR2 功能描述:處理器 - 專門應(yīng)用 Catskills Rev1.2 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX283DJM4A 制造商:Freescale Semiconductor 功能描述:CATSKILLS REV 1.1 - Trays 制造商:Freescale Semiconductor 功能描述:IC MCU 32BIT ROMLESS 289MAPBGA
MCIMX283DVM4B 功能描述:處理器 - 專門應(yīng)用 CATSKILLS REV 1.2 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX285AJM4A 制造商:Freescale Semiconductor 功能描述:CATSKILLS REV 1.1 - Bulk
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*