參數(shù)資料
型號(hào)： MC8641DVU1250JC
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： MICROPROCESSOR, CBGA1023
封裝： 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023
文件頁數(shù)： 32/140頁
文件大?。?/td> 1484K
代理商： MC8641DVU1250JC
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 0
Freescale Semiconductor
127
System Design Information
TSEC2_TXD[4] and TSEC2_TX_ER pins function as cfg_dram_type[0 or 1] at reset and MUST BE
VALID BEFORE HRESET ASSERTION when coming out of device sleep mode.
20.6.1
Special instructions for Single Core device
The mechanical drawing for the single core device does not have all the solder balls that exist on the single
core device. This includes all the balls for VDD_Core1 and SENSEVDD_Core1 which exist on the
package for the dual core device, but not on the single core package. A solder ball is present for
SENSEVSS_Core1 and needs to be connected to ground with a weak (2-10 kΩ) pull down resistor.
Likewise, AVDD_Core1 needs to be pulled to ground as shown in Figure 64.
The mechanical drawing for the single core device is located in Section 16.2, “Mechanical Dimensions of
For other pin pull-up or pull-down recommendations of signals, please see Section 17, “Signal Listings.”
20.7
Output Buffer DC Impedance
The MPC8641 drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 66). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
Figure 66. Driver Impedance Measurement
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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