參數(shù)資料
型號: MC8640DTVU1000HE
廠商: Freescale Semiconductor
文件頁數(shù): 14/130頁
文件大?。?/td> 0K
描述: IC MPU DUAL CORE E600 1023FCCBGA
標準包裝: 1
系列: MPC86xx
處理器類型: 32-位 MPC86xx PowerPC
速度: 1.0GHz
電壓: 1.05V
安裝類型: 表面貼裝
封裝/外殼: 1023-BCBGA,F(xiàn)CCBGA
供應商設備封裝: 1023-FCCBGA(33x33)
包裝: 托盤
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
110
Freescale Semiconductor
Thermal
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
19.2.1
Internal Package Conduction Resistance
For the exposed-die packaging technology described in Table 71, the intrinsic conduction thermal
resistance paths are as follows:
The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
The die junction-to-board thermal resistance
Figure 60 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 60. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
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